Issued Patents All Time
Showing 76–100 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222857 | Method of forming a photoresist over a bond pad to mitigate bond pad corrosion | Chih-Fan Huang, Mao-Nan Wang, Tzu-Li Lee, Yen-Ming Chen, Tzung-Luen Li | 2022-01-11 |
| 11222946 | Semiconductor device including a high density MIM capacitor and method | Jin-Mu Yin, Hung-Chao Kao, Hui-Chi Chen, Hsiang-Ku Shen, Yen-Ming Chen | 2022-01-11 |
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Chih-Fan Huang, Mao-Nan Wang, Kuo-Chin Chang, Hui-Chi Chen, Yen-Ming Chen | 2021-11-30 |
| 11145564 | Multi-layer passivation structure and method | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Yen-Ming Chen | 2021-10-12 |
| 11114373 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Hsiang-Ku Shen | 2021-09-07 |
| 11081445 | Semiconductor device comprising air gaps having different configurations | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, Tai-Yang Wu | 2021-08-03 |
| 11056556 | Metal-insulator-metal capacitive structure and methods of fabricating thereof | Hsiang-Ku Shen, Ming-Hong Kao, Hui-Chi Chen, Yen-Ming Chen | 2021-07-06 |
| 11031325 | Low-stress passivation layer | Hsiang-Ku Shen, Chun-Li Lin | 2021-06-08 |
| 11031458 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen +1 more | 2021-06-08 |
| 10879179 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, TaiYang Wu | 2020-12-29 |
| 10861810 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue +1 more | 2020-12-08 |
| 10734474 | Metal-insulator-metal structure and methods of fabrication thereof | Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen +2 more | 2020-08-04 |
| 10468478 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen +1 more | 2019-11-05 |
| 10395937 | Fin patterning for semiconductor devices | Tzung-Yi Tsai, Yen-Ming Chen, Han-Ting Tsai, Tsung-Lin Lee, Chia-Cheng Ho +1 more | 2019-08-27 |
| 10361152 | Semiconductor structure having an air-gap region and a method of manufacturing the same | Shu-Hui Su, Cheng-Lin Huang, Jiing-Feng Yang, Zhen-Cheng Wu, Ren-Guei Wu +1 more | 2019-07-23 |
| 10361156 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Jye-Yen Cheng, Sheung-Hsuan Wei, Li-Yu Lee, Tai-Yang Wu | 2019-07-23 |
| 10157843 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, TaiYang Wu | 2018-12-18 |
| 9881870 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Pei-Ru Lee, Tai-Yang Wu | 2018-01-30 |
| 9852992 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, TaiYang Wu | 2017-12-26 |
| 9653348 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Pei-Ru Lee, Tai-Yang Wu | 2017-05-16 |
| 9553043 | Interconnect structure having smaller transition layer via | Lee-Chung Lu, Wen-Hao Chen, Yuan-Te Hou, Fang-Yu Fan, Yu-Hsiang Kao +2 more | 2017-01-24 |
| 9543193 | Non-hierarchical metal layers for integrated circuits | Lee-Chung Lu, Yuan-Te Hou, Shyue-Shyh Lin, Li-Chun Tien | 2017-01-10 |
| 9257279 | Mask treatment for double patterning design | Jiing-Feng Yang, Chii-Ping Chen | 2016-02-09 |
| 9153484 | Methods of forming integrated circuits | Chii-Ping Chen | 2015-10-06 |
| 9117882 | Non-hierarchical metal layers for integrated circuits | Lee-Chung Lu, Yuan-Te Hou, Shyue-Shyh Lin, Li-Chun Tien | 2015-08-25 |