Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136211 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsun Lee, Pei-Haw Tsao, Kuo-Chin Chang, Bill Kiang | 2015-09-15 |
| 9118255 | Flyback power converter and electronic apparatus | WEI-LIEH LAI, Chu-Yi Chou, Yu-Kang Lo, HUANG-JEN CHIU, Jing-Yuan Lin | 2015-08-25 |
| 9099530 | Methods of patterning small via pitch dimensions | Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen, Hsiang-Lin Chen +2 more | 2015-08-04 |
| 8829653 | Exclusion zone for stress-sensitive circuit design | Chao-Yuan Su | 2014-09-09 |
| 8728332 | Methods of patterning small via pitch dimensions | Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen, Hsiang-Lin Chen +2 more | 2014-05-20 |
| 8624346 | Exclusion zone for stress-sensitive circuit design | Chao-Yuan Su | 2014-01-07 |
| 8492263 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsiun Lee, Pei-Haw Tsao, Kuo-Chin Chang, Bill Kiang | 2013-07-23 |
| 7792326 | Method of tracking vocal target | — | 2010-09-07 |
| 7716788 | Hinge for a tablet computer extension pad | — | 2010-05-18 |
| 7588963 | Method of forming overhang support for a stacked semiconductor device | Te-Tsung Chao, Mirng-Ji Lii, Abel Chang | 2009-09-15 |
| 7361986 | Heat stud for stacked chip package | Tsorng-Dih Yuan, Hsin-Yu Pan | 2008-04-22 |
| 7138300 | Structural design for flip-chip assembly | Tsorng-Dih Yuan, Hsin-Yu Pan | 2006-11-21 |
| 7116002 | Overhang support for a stacked semiconductor device, and method of forming thereof | Te-Tsung Chao, Mirng-Ji Lii, Abel Chang | 2006-10-03 |
| 6493902 | Automatic wall cleansing apparatus | — | 2002-12-17 |