Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6176141 | Method for stud pull test for film formed on semiconductor device | Lung-Hsiang Chuang, Syun-Ming Jang, Ying-Chen Chao | 2001-01-23 |
| 6153512 | Process to improve adhesion of HSQ to underlying materials | Syun-Ming Jang | 2000-11-28 |
| 6136680 | Methods to improve copper-fluorinated silica glass interconnects | Jane-Bai Lai, Chung-Shi Liu, Tien-I Bao, Syun-Ming Jang, Hui Wang +4 more | 2000-10-24 |
| 6049137 | Readable alignment mark structure formed using enhanced chemical mechanical polishing | Syun-Ming Jang, Ying-Ho Chen, Chen-Hua Yu | 2000-04-11 |
| 6010962 | Copper chemical-mechanical-polishing (CMP) dishing | Chung-Shi Liu, Chen-Hua Yu | 2000-01-04 |
| 5972798 | Prevention of die loss to chemical mechanical polishing | Syun-Ming Jang, Jui-Yu Chang, Chen-Hua Yu, Tsu Shih, Jeng-Horng Chen | 1999-10-26 |
| 5933744 | Alignment method for used in chemical mechanical polishing process | Jeng-Horng Chen, Tsu Shih, Jui-Yu Chang | 1999-08-03 |
| 5786260 | Method of fabricating a readable alignment mark structure using enhanced chemical mechanical polishing | Syun-Ming Jang, Ying-Ho Chen, Chen-Hua Yu | 1998-07-28 |
| 5773360 | Reduction of surface contamination in post-CMP cleaning | Chen-Hua Yu, Syun-Ming Jang | 1998-06-30 |
| 5709755 | Method for CMP cleaning improvement | So Wein Kuo, Tsu Shih | 1998-01-20 |