Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553489 | Partitioned wafer and semiconductor die | Wei Huang, Chia-Wei Liu, Li-Hsin Chu | 2020-02-04 |
| 10546917 | Trench capacitor layout structure and method of forming same background | Yu-Hsiang Tsai, Chia-Ping Lai | 2020-01-28 |
| 10453881 | Infrared image sensor component | Chien-Ying Wu, Li-Hsin Chu, Chia-Wei Liu | 2019-10-22 |
| 10438838 | Semiconductor structure and related method | Yu-Hsiang Tsai, Li-Hsin Chu, Chia-Wei Liu | 2019-10-08 |
| 9984971 | Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers | Chia-Wei Liu, Fang-Ting Kuo, Ren-Wei Xiao | 2018-05-29 |
| 9905466 | Wafer partitioning method and device formed | Wei Huang, Chia-Wei Liu, Li-Hsin Chu | 2018-02-27 |
| 9871067 | Infrared image sensor component | Chien-Ying Wu, Li-Hsin Chu, Chia-Wei Liu | 2018-01-16 |
| 9699897 | Pad structure | Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Chia-Wei Liu | 2017-07-04 |
| 9691807 | CMOS image sensor structure | Chiao-Chi Wang, Li-Hsin Chu, Chia-Wei Liu | 2017-06-27 |
| 9673248 | Image sensing device and manufacturing method thereof | Tsung-Han Kuo, Li-Hsin Chu, Zhi-Wei Zhuang | 2017-06-06 |
| 9627249 | Semiconductor structure and method for manufacturing the same | Yu-Hsiang Tsai, Chia-Wei Liu, Li-Hsin Chu | 2017-04-18 |
| 9620551 | Mechanisms for forming backside illuminated image sensor device structure | Chia-Wei Liu, Li-Hsin Chu, Yu-Hsiang Tsai | 2017-04-11 |
| 9530690 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao | 2016-12-27 |
| 9524997 | Semiconductor device having seal ring | Zhi-Wei Zhuang, Chia-Wei Liu, Li-Hsin Chu | 2016-12-20 |
| 9368478 | Microelectronic package and method of manufacture thereof | Wael Zohni | 2016-06-14 |
| 9287303 | CMOS image sensor structure | Chiao-Chi Wang, Li-Hsin Chu, Chia-Wei Liu | 2016-03-15 |
| 9281336 | Mechanisms for forming backside illuminated image sensor device structure | Chia-Wei Liu, Li-Hsin Chu, Yu-Hsiang Tsai | 2016-03-08 |
| 9177914 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chia-Wei Liu, Cindy Kuo, Ren-Wei Xiao | 2015-11-03 |
| 8946901 | Microelectronic package and method of manufacture thereof | Wael Zohni | 2015-02-03 |
| 7964947 | Stacking packages with alignment elements | Ilyas Mohammed | 2011-06-21 |