Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12364036 | Germanium-based photodetector with reduced dark current | Yeh-Hsun Fang, Zhi-Wei Zhuang | 2025-07-15 |
| 12211838 | Device including MIM capacitor and resistor | Chen-Hsiang Hung, Chia-Ping Lai, Chung-Chuan Tseng | 2025-01-28 |
| 12191328 | Photodetector with reduced dark current sensitivity and methods of forming the same | Yeh-Hsun Fang, Zhi-Wei Zhuang | 2025-01-07 |
| 12051593 | Method for an ion implantation process employing an ion-collecting device that collects a distribution of ejected ions from a target to correct a tilt angle of the target | Chun-Jung Huang, Po-Feng Tsai, Henry Peng, Kuang-Huan Hsu, Tsung Wei Chen +1 more | 2024-07-30 |
| 11784199 | Image sensor device | Chen-Hsiang Hung, Chung-Chuan Tseng, Chia-Ping Lai | 2023-10-10 |
| 11756955 | Device including MIM capacitor and resistor | Chen-Hsiang Hung, Chia-Ping Lai, Chung-Chuan Tseng | 2023-09-12 |
| 11615961 | Method for ion implantation that adjusts a targets tilt angle based on a distribution of ejected ions from a target | Chun-Jung Huang, Po-Feng Tsai, Henry Peng, Kuang-Huan Hsu, Tsung Wei Chen +1 more | 2023-03-28 |
| 11587824 | Method for manufacturing semiconductor structure | Yu-Hsiang Tsai, Chung-Chuan Tseng, Chia-Wei Liu | 2023-02-21 |
| 11488993 | Image sensor device | Chen-Hsiang Hung, Chung-Chuan Tseng, Chia-Ping Lai | 2022-11-01 |
| 11476288 | Infrared image sensor component manufacturing method | Chien-Ying Wu, Chung-Chuan Tseng, Chia-Wei Liu | 2022-10-18 |
| 11195720 | Method for ion implantation that adjusts a target's tilt angle based on a distribution of ejected ions from a target | Chun-Jung Huang, Po-Feng Tsai, Henry Peng, Kuang-Huan Hsu, Tsung Wei Chen +1 more | 2021-12-07 |
| 11127625 | Semiconductor structure and related method | Yu-Hsiang Tsai, Chung-Chuan Tseng, Chia-Wei Liu | 2021-09-21 |
| 10777591 | Image sensor device | Chen-Hsiang Hung, Chung-Chuan Tseng, Chia-Ping Lai | 2020-09-15 |
| 10679889 | Method for manufacturing semiconductor structure | Yu-Hsiang Tsai, Chung-Chuan Tseng, Chia-Wei Liu | 2020-06-09 |
| 10553489 | Partitioned wafer and semiconductor die | Wei Huang, Chung-Chuan Tseng, Chia-Wei Liu | 2020-02-04 |
| 10453881 | Infrared image sensor component | Chien-Ying Wu, Chung-Chuan Tseng, Chia-Wei Liu | 2019-10-22 |
| 10438838 | Semiconductor structure and related method | Yu-Hsiang Tsai, Chung-Chuan Tseng, Chia-Wei Liu | 2019-10-08 |
| 9905466 | Wafer partitioning method and device formed | Wei Huang, Chung-Chuan Tseng, Chia-Wei Liu | 2018-02-27 |
| 9871067 | Infrared image sensor component | Chien-Ying Wu, Chung-Chuan Tseng, Chia-Wei Liu | 2018-01-16 |
| 9691807 | CMOS image sensor structure | Chiao-Chi Wang, Chung-Chuan Tseng, Chia-Wei Liu | 2017-06-27 |
| 9673248 | Image sensing device and manufacturing method thereof | Tsung-Han Kuo, Chung-Chuan Tseng, Zhi-Wei Zhuang | 2017-06-06 |
| 9627249 | Semiconductor structure and method for manufacturing the same | Yu-Hsiang Tsai, Chung-Chuan Tseng, Chia-Wei Liu | 2017-04-18 |
| 9620551 | Mechanisms for forming backside illuminated image sensor device structure | Chung-Chuan Tseng, Chia-Wei Liu, Yu-Hsiang Tsai | 2017-04-11 |
| 9524997 | Semiconductor device having seal ring | Zhi-Wei Zhuang, Chung-Chuan Tseng, Chia-Wei Liu | 2016-12-20 |
| 9287303 | CMOS image sensor structure | Chiao-Chi Wang, Chung-Chuan Tseng, Chia-Wei Liu | 2016-03-15 |