Issued Patents All Time
Showing 126–150 of 247 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088092 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu +3 more | 2021-08-10 |
| 11063005 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu +3 more | 2021-07-13 |
| 11063045 | Semiconductor device and method of manufacturing the same | Guo-Huei Wu, Jerry Chang Jui Kao, Hui-Zhong Zhuang, Jung-Chan Yang, Lee-Chung Lu +1 more | 2021-07-13 |
| 11043426 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chun-Kuang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2021-06-22 |
| 11024579 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +3 more | 2021-06-01 |
| 11018157 | Local interconnect structure | Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +5 more | 2021-05-25 |
| 10977050 | Method for managing system boot code memory, memory device and electronic system using the same | — | 2021-04-13 |
| 10978439 | Method and system of manufacturing conductors and semiconductor device which includes conductors | Kam-Tou Sio, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang, Ko-Bin Kao +2 more | 2021-04-13 |
| 10977421 | System for and method of manufacturing an integrated circuit | Wei-Cheng Lin, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2021-04-13 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng, Hsin-Chih Chen +6 more | 2021-03-16 |
| 10937695 | FinFET switch | Kam-Tou Sio, Charles Chew-Yuen Young, Ho Che Yu | 2021-03-02 |
| 10930595 | Standard cells having via rail and deep via structures | Wei-Cheng Lin, Cheng-Chi Chuang, Charles Chew-Yuen Young, Hui-Ting Yang, Wayne Lai | 2021-02-23 |
| 10879120 | Self aligned via and method for fabricating the same | Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-12-29 |
| 10879173 | Middle-end-of-line strap for standard cell | Meng-Hung Shen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio, Wei-Cheng Lin | 2020-12-29 |
| 10879229 | Integrated circuit, system for and method of forming an integrated circuit | Kam-Tou Sio, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Jiann-Tyng Tzeng, Yi-Hsun Chiu | 2020-12-29 |
| 10867833 | Buried metal for FinFET device and method | Lei-Chun Chou, Jiann-Tyng Tzeng, Chih-Ming Lai, Ru-Gun Liu, Charles Chew-Yuen Young | 2020-12-15 |
| 10868001 | Semiconductor device and manufacturing method thereof | Kuo-Cheng Ching, Chih-Hao Wang, Shi Ning Ju | 2020-12-15 |
| 10861750 | Method of manufacturing a semiconductor device and a semiconductor device | Hung-Li Chiang, Tzu-Chiang Chen, I-Sheng Chen, Lei-Chun Chou | 2020-12-08 |
| 10861509 | Asynchronous/synchronous interface | Dean Nobunaga, June Lee | 2020-12-08 |
| 10861790 | Power strap structure for high performance and low current density | Chih-Ming Lai, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng, Kam-Tou Sio +6 more | 2020-12-08 |
| 10847460 | Advanced metal connection with metal cut | Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2020-11-24 |
| 10833061 | Semiconductor device including source/drain contact having height below gate stack | Charles Chew-Yuen Young, Chih-Ming Lai, Jiann-Tyng Tzeng, Shun Li Chen, Kam-Tou Sio +3 more | 2020-11-10 |
| 10804402 | Metal rail conductors for non-planar semiconductor devices | Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Kam-Tou Sio, Shih-Wei Peng +2 more | 2020-10-13 |
| 10784168 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chun-Kuang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-09-22 |
| 10763365 | Metal rail conductors for non-planar semiconductor devices | Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kuo-Cheng Ching +5 more | 2020-09-01 |