Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8775993 | Integrated circuit design flow with layout-dependent effects | Mu-Jen Huang, Yu Jiang | 2014-07-08 |
| 8745552 | EDA tool and method, and integrated circuit formed by the method | Hsien Yu Tseng, Shih-Kai Lin, Chin-Shen Lin, Yu Jiang, Heng-Kai Liu +1 more | 2014-06-03 |
| 8726207 | On-the-fly device characterization from layouts of circuits | Yu Jiang, Ya-Li Tai, Mu-Jen Huang, Chauchin Su | 2014-05-13 |
| 8726220 | System and methods for converting planar design to FinFET design | Yi-Tang Lin, Cheok-Kei Lei, Shu-Yu Chen, Yu-Ning Chang, Hsiao-Hui Chen +2 more | 2014-05-13 |
| 8666377 | Method, system and computer-readable medium for synchronizing spot information | Po-Yen Lee, Pai-Chang Yeh, Li-Wen Lian | 2014-03-04 |
| 8621571 | Online service providing system, method, server and mobile device thereof, and computer program product | Po-Yen Lee, Pai-Chang Yeh, Li-Wen Lian | 2013-12-31 |
| 8621406 | System and methods for converting planar design to FinFET design | Cheok-Kei Lei, Yi-Tang Lin, Hsiao-Hui Chen, Yu-Ning Chang, Shu-Yu Chen +2 more | 2013-12-31 |
| 8572537 | Accurate parasitic capacitance extraction for ultra large scale integrated circuits | Ke-Ying Su, Chia-Ming Ho, Gwan Sin Chang | 2013-10-29 |
| 8543333 | Method, system, apparatus and computer-readable medium for browsing spot information | Po-Yen Lee, Pai-Chang Yeh, Li-Wen Lian | 2013-09-24 |
| 8518722 | Method for detecting the under-fill void in flip chip BGA | Chia-Jen Kao, Jui-Cheng Chuang | 2013-08-27 |
| 8492883 | Semiconductor package having a cavity structure | Pao-Huei Chang Chien, Ping Hu, Hsu-Yang Lee | 2013-07-23 |
| 8444705 | Knee joint prosthesis | Chien-Cheng Chen | 2013-05-21 |
| 8397380 | Controlling warpage in BGA components in a re-flow process | Chia-Jen Kao, Chen-Fa Tsai | 2013-03-19 |
| 8284537 | Battery cell and electronic apparatus with electrostatic discharge protection | — | 2012-10-09 |
| 8278145 | Method for packaging semiconductor device | Longqiang Zu, Chen-Fa Tsai | 2012-10-02 |
| 8214784 | Accurate parasitic capacitance extraction for ultra large scale integrated circuits | Ke-Ying Su, Chia-Ming Ho, Gwan Sin Chang | 2012-07-03 |
| 8120152 | Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof | Pao-Huei Chang Chien, Ping Hu | 2012-02-21 |
| 8115285 | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof | Yi-Shao Lai, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Pao-Huei Chang Chien, Ping Hu +1 more | 2012-02-14 |
| 7924536 | Short protection device for alternator | — | 2011-04-12 |
| 7863440 | Macrocyclic carbodiimides (MC-CDI) and their derivatives, syntheses and applications of the same | Shenghong A. Dai, Chih-Chia Cheng, Chih-Hung Chen | 2011-01-04 |
| 7818698 | Accurate parasitic capacitance extraction for ultra large scale integrated circuits | Ke-Ying Su, Chia-Ming Ho, Gwan Sin Chang | 2010-10-19 |
| 7799927 | Indolestyryl compound and high density recording media utilizing the same | Shin-Shin Wang, Jong-Lieh Yang, Chii-Chang Lai, Hui-Ping Tsai, Wen-Ping Chu +5 more | 2010-09-21 |
| 7772307 | Water dispersible polyisocyanate composition and its uses | Shenghong A. Dai, Chinghung Chen, Will Yang, Tsai-Lung Chen | 2010-08-10 |
| 7598360 | Bisstyryl compound and high density recording media utilizing the same | Shin-Shin Wang, Jong-Lieh Yang, Chii-Chang Lai, Hui-Ping Tsai, Wen-Ping Chu +5 more | 2009-10-06 |
| 7598359 | Bis (indolestyryl) compound and high density recording media utilizing the same | Shin-Shin Wang, Jong-Lieh Yang, Chii-Chang Lai, Hui-Ping Tsai, Wen-Ping Chu +3 more | 2009-10-06 |