Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410984 | Package substrate differential impedance optimization for 25 to 60 GBPS and beyond | Li-Chang Hsiao | 2019-09-10 |
| 10276519 | Package substrate differential impedance optimization for 25 to 60 Gbps and beyond | Li-Chang Hsiao | 2019-04-30 |
| 9666544 | Package substrate differential impedance optimization for 25 GBPS and beyond | Li-Chang Hsiao | 2017-05-30 |
| 8278145 | Method for packaging semiconductor device | Chien-Wen Chen, Chen-Fa Tsai | 2012-10-02 |
| 8247909 | Semiconductor package device with cavity structure and the packaging method thereof | Yu-Yu Lin | 2012-08-21 |
| 8152048 | Method and structure for adapting solder column to warped substrate | — | 2012-04-10 |
| 6879494 | Circuit package for electronic systems | Jennifer A. Hester | 2005-04-12 |
| 6594153 | Circuit package for electronic systems | Jennifer A. Hester | 2003-07-15 |
| 6303871 | Degassing hole design for olga trace impedance | Huong Do | 2001-10-16 |
| 6177732 | Multi-layer organic land grid array to minimize via inductance | — | 2001-01-23 |