Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
LZ

Longqiang Zu — 10 Patents

Intel: 4 patents #8,538 of 30,777Top 30%
GUGlobal Unichip: 3 patents #51 of 210Top 25%
TSMC: 1 patents #8,466 of 12,232Top 70%
Palo Alto, CA: #2,304 of 9,675 inventorsTop 25%
California: #61,378 of 386,348 inventorsTop 20%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Longqiang Zu has been granted 10 US patents while listed as an inventor at Intel. The first was granted in 2001 and the most recent in September 2019. Longqiang Zu ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Longqiang Zu in Palo Alto, CA, US.

Patents per Year

Patents granted per year, 2001 to 2019Bar chart with a peak of 3 patents in 2012.peak 32001: 2 patents20012003: 1 patents20032005: 1 patents20052012: 3 patents20122017: 1 patents20172019: 2 patents2019

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10410984 Package substrate differential impedance optimization for 25 to 60 GBPS and beyond Li-Chang Hsiao 2019-09-10
10276519 Package substrate differential impedance optimization for 25 to 60 Gbps and beyond Li-Chang Hsiao 2019-04-30
9666544 Package substrate differential impedance optimization for 25 GBPS and beyond Li-Chang Hsiao 2017-05-30
8278145 Method for packaging semiconductor device Chien-Wen Chen, Chen-Fa Tsai 2012-10-02
8247909 Semiconductor package device with cavity structure and the packaging method thereof Yu-Yu Lin 2012-08-21
8152048 Method and structure for adapting solder column to warped substrate 2012-04-10 $5,546,000
6879494 Circuit package for electronic systems Jennifer A. Hester 2005-04-12 $19,475,000
6594153 Circuit package for electronic systems Jennifer A. Hester 2003-07-15 $37,859,000
6303871 Degassing hole design for olga trace impedance Huong Do 2001-10-16 $231,350,000
6177732 Multi-layer organic land grid array to minimize via inductance 2001-01-23 $255,018,000