Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492883 | Semiconductor package having a cavity structure | Pao-Huei Chang Chien, Ping Hu, Chien-Wen Chen | 2013-07-23 |
| 8115285 | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof | Chien-Wen Chen, Yi-Shao Lai, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Pao-Huei Chang Chien +1 more | 2012-02-14 |