Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Il Kwon Shim, Seng Guan Chow, Byung Joon Han | 2005-03-01 |
| 6841858 | Leadframe for die stacking applications and related die stacking concepts | Il Kwon Shim, Seng Guan Chow | 2005-01-11 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, Lee Smith, David Zoba, Vincent DiCaprio | 2003-11-18 |
| 6627990 | Thermally enhanced stacked die package | Il Kwon Shim, Seng Gaun Chow | 2003-09-30 |
| 6531784 | Semiconductor package with spacer strips | Il Kwon Shim, Vincent DiCaprio | 2003-03-11 |
| 6472758 | Semiconductor package including stacked semiconductor dies and bond wires | Thomas P. Glenn, Lee Smith, David Zoba, Vincent DiCaprio | 2002-10-29 |
| 5877551 | Semiconductor package having a ground or power ring and a metal substrate | Salvador Tostado, George A. Brathwaite, Paul R. Hoffman, George A. Erfe, Serafin P. Pedron, Jr. +3 more | 1999-03-02 |