Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8124459 | Bump chip carrier semiconductor package system | Han Shin Youn, Jae Soo Lee | 2012-02-28 |
| 8102666 | Integrated circuit package system | HyungSang Park, DeokKyung Yang, Soo-San Park | 2012-01-24 |
| 8080446 | Integrated circuit packaging system with interposer interconnections and method of manufacture thereof | A Leam Choi, Kenny Lee, HanGil Shin | 2011-12-20 |
| 8035210 | Integrated circuit package system with interposer | JoungIn Yang, Dongjin Jung | 2011-10-11 |
| 7875967 | Integrated circuit with step molded inner stacking module package in package system | DeokKyung Yang, Jae Han Chung | 2011-01-25 |
| 7800212 | Mountable integrated circuit package system with stacking interposer | JoHyun Bae, HanGil Shin | 2010-09-21 |
| 7710735 | Multichip package system | JoHyun Bae | 2010-05-04 |
| 7667314 | Integrated circuit package system with mold lock subassembly | Sungmin Song | 2010-02-23 |
| 7306971 | Semiconductor chip packaging method with individually placed film adhesive pieces | Jin-Wook Jeong, Hee Bong Lee, Hyun Joon Oh, Hyeog Chan Kwon, Jong Wook Ju +1 more | 2007-12-11 |