Issued Patents All Time
Showing 101–125 of 171 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7172497 | Fabrication of semiconductor interconnect structures | Homayoun Talieh | 2007-02-06 |
| 7147766 | Chip interconnect and packaging deposition methods and structures | Cyprian Emeka Uzoh, Homayoun Talieh | 2006-12-12 |
| 7141146 | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface | Jeffrey Bogart | 2006-11-28 |
| 7129165 | Method and structure to improve reliability of copper interconnects | Homayoun Talieh | 2006-10-31 |
| 7122473 | Edge and bevel cleaning process and system | Jalal Ashjaee, Rimma Volodarsky, Cyprian Emeka Uzoh, Homayoun Talieh | 2006-10-17 |
| 7115510 | Method for electrochemically processing a workpiece | Homayoun Talieh, Cyprian Emeka Uzoh | 2006-10-03 |
| 7097538 | Advanced chemical mechanical polishing system with smart endpoint detection | Homayoun Talieh | 2006-08-29 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper | Halit Yakupoglu, Cyprian Emeka Uzoh, Homayoun Talieh | 2006-08-29 |
| 7091136 | Method of forming semiconductor compound film for fabrication of electronic device and film produced by same | — | 2006-08-15 |
| 7064057 | Method and apparatus for localized material removal by electrochemical polishing | — | 2006-06-20 |
| 7059944 | Integrated system for processing semiconductor wafers | Jalal Ashjaee, Boris Govzman, Bernard Frey, Boguslaw Nagorski, Douglas W. Young +1 more | 2006-06-13 |
| 7045040 | Process and system for eliminating gas bubbles during electrochemical processing | — | 2006-05-16 |
| 7029567 | Electrochemical edge and bevel cleaning process and system | — | 2006-04-18 |
| 6988932 | Apparatus of sealing wafer backside for full-face processing | Jalal Ashjaee, Homayoun Talieh, Konstantin Volodarsky | 2006-01-24 |
| 6974769 | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization | Homayoun Talieh, Cyprian Emeka Uzoh | 2005-12-13 |
| 6967166 | Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing | Jeffrey Bogart, Efrain Velazquez | 2005-11-22 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Homayoun Talieh | 2005-10-25 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-09-20 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-09-13 |
| 6943112 | Defect-free thin and planar film processing | Cyprian Emeka Uzoh | 2005-09-13 |
| 6939206 | Method and apparatus of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Homayoun Talieh, Konstantin Volodarsky | 2005-09-06 |
| 6936154 | Planarity detection methods and apparatus for electrochemical mechanical processing systems | Cyprian Emeka Uzoh | 2005-08-30 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-08-23 |
| 6921551 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece | — | 2005-07-26 |
| 6908374 | Chemical mechanical polishing endpoint detection | Yuchun Wang, Bernard Frey, Douglas W. Young, Homayoun Talieh, Efrain Velazquez | 2005-06-21 |