Issued Patents All Time
Showing 126–150 of 171 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905588 | Packaging deposition methods | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-06-14 |
| 6866763 | Method and system monitoring and controlling film thickness profile during plating and electroetching | Cyprian Emeka Uzoh | 2005-03-15 |
| 6867136 | Method for electrochemically processing a workpiece | Homayoun Talieh, Cyprian Emeka Uzoh | 2005-03-15 |
| 6861354 | Method and structure to reduce defects in integrated circuits and substrates | Cyprian Emeka Uzoh, Homayoun Talieh | 2005-03-01 |
| 6858121 | Method and apparatus for filling low aspect ratio cavities with conductive material at high rate | — | 2005-02-22 |
| 6857947 | Advanced chemical mechanical polishing system with smart endpoint detection | Yuchun Wang, Bernard Frey, Homayoun Talieh, Douglas W. Young, Brett E. McGrath +3 more | 2005-02-22 |
| 6855037 | Method of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Homayoun Talieh, Konstantin Volodarsky | 2005-02-15 |
| 6852630 | Electroetching process and system | Cyprian Emeka Uzoh, Halit Yakupoglu, Homayoun Talieh | 2005-02-08 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer | Jalal Ashjaee, Boguslaw Nagorski, Homayoun Talieh, Cyprian Emeka Uzoh | 2005-02-08 |
| 6833063 | Electrochemical edge and bevel cleaning process and system | — | 2004-12-21 |
| 6821409 | Electroetching methods and systems using chemical and mechanical influence | Cyprian Emeka Uzoh, Paul Lindquist, Homayoun Talieh | 2004-11-23 |
| 6815354 | Method and structure for thru-mask contact electrodeposition | Cyprian Emeka Uzoh, Homayoun Talieh | 2004-11-09 |
| 6802946 | Apparatus for controlling thickness uniformity of electroplated and electroetched layers | Paul Lindquist | 2004-10-12 |
| 6780772 | Method and system to provide electroplanarization of a workpiece with a conducting material layer | Cyprian Emeka Uzoh, Homayoun Talieh | 2004-08-24 |
| 6777338 | Edge and bevel cleaning process and system | Jalal Ashjaee, Rimma Volodarsky, Cyprian Emeka Uzoh, Homayoun Talieh | 2004-08-17 |
| 6722946 | Advanced chemical mechanical polishing system with smart endpoint detection | Homayoun Talieh | 2004-04-20 |
| 6716084 | Carrier head for holding a wafer and allowing processing on a front face thereof to occur | Cyprian Emeka Uzoh, Konstantin Volodarsky | 2004-04-06 |
| 6695962 | Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs | Cyprian Emeka Uzoh, Homayoun Talieh | 2004-02-24 |
| 6666959 | Semiconductor workpiece proximity plating methods and apparatus | Cyprian Emeka Uzoh, Homayoun Talieh, Douglas W. Young | 2003-12-23 |
| 6649523 | Method and system to provide material removal and planarization employing a reactive pad | Cyprian Emeka Uzoh, Homayoun Talieh | 2003-11-18 |
| 6630059 | Workpeice proximity plating apparatus | Cyprian Emeka Uzoh, Homayoun Talieh, Douglas W. Young | 2003-10-07 |
| 6610190 | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate | Cyprian Emeka Uzoh, Homayoun Talieh | 2003-08-26 |
| 6579800 | Chemical mechanical polishing endpoint detection | Homayoun Talleh | 2003-06-17 |
| 6534116 | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence | — | 2003-03-18 |
| 6497800 | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating | Homayoun Talieh, Cyprian Emeka Uzoh | 2002-12-24 |