Issued Patents All Time
Showing 76–100 of 171 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7404886 | Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece | — | 2008-07-29 |
| 7399516 | Long-life workpiece surface influencing device structure and manufacturing method | George Xinsheng Guo | 2008-07-15 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus | Cyprian Emeka Uzoh, Homayoun Talieh | 2008-05-27 |
| 7374963 | Technique and apparatus for depositing thin layers of semiconductors for solar cell fabrication | — | 2008-05-20 |
| 7329335 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Cyprian Emeka Uzoh | 2008-02-12 |
| 7316602 | Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing | Jalal Ashjaee, Konstantin Volodarsky | 2008-01-08 |
| 7311811 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Cyprian Emeka Uzoh | 2007-12-25 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Cyprian Emeka Uzoh | 2007-12-18 |
| 7309407 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Homayoun Talieh | 2007-12-18 |
| 7282124 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Cyprian Emeka Uzoh | 2007-10-16 |
| 7257893 | Efficient wafer processing technology | Hung-Ming Wang, Homayoun Talieh | 2007-08-21 |
| 7250104 | Method and system for optically enhanced metal planarization | Cyprian Emeka Uzoh, Homayoun Talieh, Halit Yakupoglu | 2007-07-31 |
| 7250103 | Method and apparatus for eliminating defects and improving uniformity in electrochemically processed conductive layers | — | 2007-07-31 |
| 7247558 | Method and system for electroprocessing conductive layers | Homayoun Talieh | 2007-07-24 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes | Homayoun Talieh, Cyprian Emeka Uzoh | 2007-07-17 |
| 7238092 | Low-force electrochemical mechanical processing method and apparatus | Cyprian Emeka Uzoh, Jeffrey Bogart | 2007-07-03 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes | Homayoun Talieh, Boguslaw Nagorski, Cyprian Emeka Uzoh, Jeffrey Bogart | 2007-05-01 |
| 7211186 | Method and system to provide electrical contacts for electrotreating processes | Homayoun Talieh | 2007-05-01 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same | Cyprian Emeka Uzoh | 2007-04-17 |
| 7204743 | Integrated circuit interconnect fabrication systems | Homayoun Talieh | 2007-04-17 |
| 7204924 | Method and apparatus to deposit layers with uniform properties | Homayoun Talieh | 2007-04-17 |
| 7201829 | Mask plate design | Cyprian Emeka Uzoh, Jeff A. Bogart | 2007-04-10 |
| 7195700 | Method of electroplating copper layers with flat topography | Cyprian Emeka Uzoh, Serdar Aksu | 2007-03-27 |
| 7195696 | Electrode assembly for electrochemical processing of workpiece | Cyprian Emeka Uzoh | 2007-03-27 |
| 7189146 | Method for reduction of defects in wet processed layers | Cyprian Emeka Uzoh | 2007-03-13 |