JK

Jong Hoon Kim

SH Sk Hynix: 72 patents #31 of 4,849Top 1%
Samsung: 67 patents #1,059 of 75,807Top 2%
CJ Cj: 13 patents #3 of 175Top 2%
LG: 7 patents #6,102 of 26,165Top 25%
LC Lg Household & Health Care: 7 patents #13 of 288Top 5%
BI Bioneer: 5 patents #5 of 107Top 5%
CH Cheiljedang: 5 patents #2 of 134Top 2%
DE Daewoo Electronics: 5 patents #47 of 680Top 7%
GC Goldstar Co.: 5 patents #43 of 863Top 5%
KI Korea Food Research Institute: 3 patents #11 of 173Top 7%
KAIST: 3 patents #3,292 of 11,619Top 30%
HC Hyundai Mobis Co.: 2 patents #479 of 1,496Top 35%
LC Ligitek Electronics Co.: 1 patents #9 of 38Top 25%
PF Postech Academy-Industry Foundation: 1 patents #529 of 1,477Top 40%
RI Rensselaer Polytechnic Institute: 1 patents #306 of 819Top 40%
FT Florida International University Board Of Trustees: 1 patents #275 of 547Top 55%
CC Cj Cheiljedang: 1 patents #489 of 827Top 60%
KF Korea University Research And Business Foundation: 1 patents #681 of 2,072Top 35%
KL Kla-Tencor: 1 patents #809 of 1,394Top 60%
LC Lg Innotek Co.: 1 patents #1,456 of 2,133Top 70%
📍 Seoul, FL: #1 of 17 inventorsTop 6%
Overall (All Time): #2,993 of 4,157,543Top 1%
210
Patents All Time

Issued Patents All Time

Showing 76–100 of 210 patents

Patent #TitleCo-InventorsDate
9906312 Semiconductor packages with optical interconnection structures, memory cards including the same, and electronic systems including the same 2018-02-27
9888567 Flexible device including sliding interconnection structure Seung Yeop Lee, Joo Hyun Kang, Han Jun Bae 2018-02-06
9850530 Automatic real-time PCR system for the various analysis of biological sample Han Oh Park, Kwon Sic Kim, Yang Won Lee, Jin-Il Lee, Byung Rae Jeong 2017-12-26
9847322 Semiconductor packages including through mold ball connectors and methods of manufacturing the same Ki Jun SUNG, Yeon Seung Jung, Hyeong-Seok Choi 2017-12-19
9847285 Semiconductor packages including heat spreaders and methods of manufacturing the same Ki Jun SUNG, Han Jun Bae 2017-12-19
9837360 Wafer level packages and electronics system including the same Hyeong-Seok Choi, Ki Jun SUNG, Young Geun Yoo, Pil Soon BAE 2017-12-05
9806016 Stretchable semiconductor packages and semiconductor devices including the same Han Jun Bae, Chan Woo Jeong 2017-10-31
9806015 Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same Ki Jun SUNG, Han Jun Bae 2017-10-31
9779202 Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements Pradeep Vukkadala, Jaydeep Sinha 2017-10-03
9748201 Semiconductor packages including an interposer 2017-08-29
9720499 Display apparatus Young-ran Han, Seung-myen LEE, Kyoung-oh CHOI 2017-08-01
9679697 Method for manufacturing multilayer ceramic condenser Hyung Joon Kim 2017-06-13
9659910 Manufacturing methods semiconductor packages including through mold connectors Ki Jun SUNG, Young Geun Yoo, Hyeong-Seok Choi 2017-05-23
9613972 Method of manufacturing semiconductor device 2017-04-04
9595392 Multilayer ceramic condenser and method of manufacturing the same Hyung Joon Kim, Kang Heon Hur, Dae Bok Oh 2017-03-14
9570370 Multi chip package and method for manufacturing the same Tac Keun OH, Ho Young SON, Jeong-Hwan Lee 2017-02-14
9547381 Electronic device and touch sensing method thereof Hyun-mook CHOI, Kyoung-oh CHOI, Young-ran Han, Jeong Hyun PARK 2017-01-17
9543251 Semiconductor chip and semiconductor package having the same Tae-Min Kang, Dae Woong Lee 2017-01-10
9518749 Forced evaporative humidifier using nano-vapor Byeong Sam Kim, Ji-Young Kim, Ki Hyun Kwon, Hwan Soo Cha 2016-12-13
9508699 Semiconductor package and method for manufacturing the same Tac Keun OH, Jeong-Hwan Lee 2016-11-29
9508688 Semiconductor packages with interposers and methods of manufacturing the same 2016-11-29
9425169 Flexible stack packages having wing portions 2016-08-23
9390997 Semiconductor chip and stacked type semiconductor package having the same Jae Hyun Son, Byoung Do Lee, Kuk-jin Chun, Woong Kyu Choi 2016-07-12
9373510 Method for manufacturing a semiconductor device 2016-06-21
9368482 Stack packages and methods of fabricating the same Han Jun Bae 2016-06-14