Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790676 | Method for producing a ferroelectric layer | Hans Cerva, Walter Hartner, Frank Hintermaier, Guenther Schindler, Volker Weinrich +1 more | 2004-09-14 |
| 6645855 | Method for fabricating an integrated semiconductor product | — | 2003-11-11 |
| 6475859 | Plasma doping for DRAM with deep trenches and hemispherical grains | Helmut Tews, Brian Lee | 2002-11-05 |
| 6465370 | Low leakage, low capacitance isolation material | Martin Schrems, Rolf-Peter Vollertsen | 2002-10-15 |
| 6329703 | Contact between a monocrystalline silicon region and a polycrystalline silicon structure and method for producing such a contact | Martin Schrems, Kai Wurster, Klaus-Dieter Morhard | 2001-12-11 |
| 6313495 | Stack capacitor with improved plug conductivity | Hua Shen | 2001-11-06 |
| 6265279 | Method for fabricating a trench capacitor | Carl Radens, Jack A. Mandelman | 2001-07-24 |
| 6068928 | Method for producing a polycrystalline silicon structure and polycrystalline silicon layer to be produced by the method | Martin Schrems, Kai Wurster, Klaus-Dieter Morhard | 2000-05-30 |
| 6046059 | Method of forming stack capacitor with improved plug conductivity | Hua Shen | 2000-04-04 |
| 6018174 | Bottle-shaped trench capacitor with epi buried layer | Martin Schrems, Jack A. Mandelman, Herbert Schaefer, Reinhard Stengl | 2000-01-25 |
| 6008103 | Method for forming trench capacitors in an integrated circuit | — | 1999-12-28 |
| 5945704 | Trench capacitor with epi buried layer | Martin Schrems, Jack A. Mandelman, Herbert Schaefer, Reinhard Stengl | 1999-08-31 |
| 5340755 | Method of making planar heterobipolar transistor having trenched isolation of the collector terminal | Hans-Peter Zwicknagl, Lothar Schleicher | 1994-08-23 |
| 5093272 | Manufacturing method for a self-aligned emitter-base-complex for heterobipolar transistors | Helmut Tews, Hans-Peter Zwicknagl | 1992-03-03 |
| 5057668 | Device for the implementation of a curing process at a semiconductor wafer and method for curing a semiconductor wafer | Spyridon Gisdakis | 1991-10-15 |