| 8878335 |
Method and system for providing fusing after packaging of semiconductor devices |
Thorsten Meyer, Josef Boeck, Rudolf Lachner |
2014-11-04 |
| 8329532 |
Process for the simultaneous deposition of crystalline and amorphous layers with doping |
Martin Franosch, Thomas Meister, Josef Boeck |
2012-12-11 |
| 8115274 |
Fuse structure and method for manufacturing same |
Josef Boeck, Herbert Knapp, Wolfgang Liebl |
2012-02-14 |
| 8067290 |
Bipolar transistor with base-collector-isolation without dielectric |
Josef Boeck, Wolfgang Liebl, Thomas Meister |
2011-11-29 |
| 7872349 |
Integrated coolant circuit arrangement, operating method and production method |
Volker Lehmann, Reinhard Stengl |
2011-01-18 |
| 7064360 |
Bipolar transistor and method for fabricating it |
Martin Franosch, Thomas Meister, Reinhard Stengl |
2006-06-20 |
| 6022786 |
Method for manufacturing a capacitor for a semiconductor arrangement |
Martin Franosch, Wolfgang Hoenlein, Helmut Klose, Gerrit Lange, Volker Lehmann +4 more |
2000-02-08 |
| 6018174 |
Bottle-shaped trench capacitor with epi buried layer |
Martin Schrems, Jack A. Mandelman, Joachim Hoepfner, Reinhard Stengl |
2000-01-25 |
| 5998807 |
Integrated CMOS circuit arrangement and method for the manufacture thereof |
Bernhard Lustig, Martin Franosch |
1999-12-07 |
| 5945704 |
Trench capacitor with epi buried layer |
Martin Schrems, Jack A. Mandelman, Joachim Hoepfner, Reinhard Stengl |
1999-08-31 |
| 5943571 |
Method for manufacturing fine structures |
Martin Franosch, Reinhard Stengl, Volker Lehmann, Hans Reisinger, Hermann Wendt |
1999-08-24 |
| 5913115 |
Method for producing a CMOS circuit |
Markus Biebl, Udo Schwalke, Dirk Schumann |
1999-06-15 |
| 5218223 |
Opto-electronic semiconductor component |
Werner Spaeth, Wolf Jakowetz, Michael Besand, Karl Osojnik |
1993-06-08 |