Issued Patents All Time
Showing 76–100 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7508079 | Circuit substrate and method of manufacturing the same | — | 2009-03-24 |
| 7507655 | Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device | Hideaki Sakaguchi | 2009-03-24 |
| 7498200 | Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Kei Murayama, Toshinori Koyama | 2009-03-03 |
| 7494898 | Method for manufacturing semiconductor device | Masahiro Sunohara, Yuichi Taguchi, Akinori Shiraishi, Naoyuki Koizumi, Kei Murayama +1 more | 2009-02-24 |
| 7488094 | Semiconductor device and manufacturing method of semiconductor device | Kei Murayama, Akinori Shiraishi, Masahiro Sunohara, Naoyuki Koizumi, Hideaki Sakaguchi +1 more | 2009-02-10 |
| 7470891 | Optical device | Naoyuki Koizumi, Masahiro Sunohara, Akinori Shiraishi, Yuichi Taguchi, Kei Murayama +1 more | 2008-12-30 |
| 7456497 | Electronic devices and its production methods | — | 2008-11-25 |
| 7420128 | Electronic component embedded substrate and method for manufacturing the same | Masahiro Sunohara, Kei Murayama, Hiroyuki Kato | 2008-09-02 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Kei Murayama, Toshinori Koyama | 2007-10-23 |
| 7279771 | Wiring board mounting a capacitor | Masahiro Sunohara, Kei Murayama, Toshio Gomyo, Yukiharu Takeuchi | 2007-10-09 |
| 7262076 | Method for production of semiconductor package | Mitsuhiro Aizawa | 2007-08-28 |
| 7217888 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Naohiro Mashino | 2007-05-15 |
| 7211370 | Method for dicing wafer | Hideaki Sakaguchi | 2007-05-01 |
| 7176052 | Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board | Hiroko Koike, Takashi Mochizuki | 2007-02-13 |
| 7169195 | Capacitor, circuit board with built-in capacitor and method of manufacturing the same | Hideaki Sakaguchi, Takashi Mochizuki | 2007-01-30 |
| 7134195 | Method of production of multilayer circuit board with built-in semiconductor chip | Masahiro Sunohara, Kei Murayama | 2006-11-14 |
| 7084009 | Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate | Masahiro Sunohara, Kei Murayama, Naohiro Mashino | 2006-08-01 |
| 7084006 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama | 2006-08-01 |
| 7078311 | Substrate-embedded capacitor, production method thereof, and circuit board | Hideaki Sakaguchi, Hiroko Koike | 2006-07-18 |
| 7067353 | Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer | Naoyuki Koizumi, Kei Murayama, Takashi Kurihara | 2006-06-27 |
| 7057290 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Toshinori Koyama, Kazutaka Kobayashi | 2006-06-06 |
| 7054141 | Capacitor, capacitor-embedded board, and method for manufacturing the capacitor | Hideaki Sakaguchi, Takashi Kurihara, Takashi Mochizuki | 2006-05-30 |
| 7025600 | Semiconductor device having external contact terminals and method for using the same | — | 2006-04-11 |
| 7019405 | Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method | Hiroko Koike, Hideaki Sakaguchi | 2006-03-28 |
| 6980416 | Capacitor, circuit board with built-in capacitor and method of manufacturing the same | Hideaki Sakaguchi, Takashi Mochizuki | 2005-12-27 |