Issued Patents All Time
Showing 101–125 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943442 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Masahiro Sunohara, Kei Murayama, Naohiro Mashino | 2005-09-13 |
| 6930392 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama | 2005-08-16 |
| 6903917 | Substrate-embedded capacitor, production method thereof, and circuit board | Hideaki Sakaguchi, Hiroko Koike | 2005-06-07 |
| 6890792 | Method of formation of a capacitor with a solid electrolyte layer comprising an organic semiconductor, and method of production of circuit board | Hiroko Koike, Takashi Mochizuki | 2005-05-10 |
| 6864120 | Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion | Kei Murayama, Hideaki Sakaguchi, Hiroko Koike | 2005-03-08 |
| 6861284 | Semiconductor device and production method thereof | Kei Murayama, Hideaki Sakaguchi, Hiroko Koike | 2005-03-01 |
| 6797603 | Semiconductor device and method of production of same | Kei Murayama | 2004-09-28 |
| 6738504 | Inspection apparatus for semiconductor device and parts mounter using same | Kei Murayama | 2004-05-18 |
| 6713863 | Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion | Kei Murayama, Hideaki Sakaguchi, Hiroko Koike | 2004-03-30 |
| 6703310 | Semiconductor device and method of production of same | Naohiro Mashino | 2004-03-09 |
| 6699787 | Semiconductor device and method of production of same | Naohiro Mashino | 2004-03-02 |
| 6678144 | Capacitor, circuit board with built-in capacitor and method for producing the same | Koji Omori, Takashi Mochizuki | 2004-01-13 |
| 6586845 | Semiconductor device module and a part thereof | Hiroko Koike | 2003-07-01 |
| 6583383 | Method and apparatus for cutting a semiconductor wafer | Hideaki Sakaguchi | 2003-06-24 |
| 6548326 | Semiconductor device and process of producing same | Tsuyoshi Kobayashi, Hiroko Koike, Kei Murayama, Hideaki Sakaguchi | 2003-04-15 |
| 6544428 | Method for producing a multi-layer circuit board using anisotropic electro-conductive adhesive layer | — | 2003-04-08 |
| 6538332 | Semiconductor device and method of production of same | Kei Murayama | 2003-03-25 |
| 6522719 | Method and apparatus for measuring a bump on a substrate | Kei Murayama | 2003-02-18 |
| 6420787 | Semiconductor device and process of producing same | Tsuyoshi Kobayashi, Hiroko Koike, Kei Murayama, Hideaki Sakaguchi | 2002-07-16 |
| 6404070 | Semiconductor device | Kei Murayama, Hideaki Sakaguchi, Hiroko Koike | 2002-06-11 |
| 6354480 | Apparatus for positioning a thin plate | Hiroko Koike | 2002-03-12 |
| 6331679 | Multi-layer circuit board using anisotropic electro-conductive adhesive layer | — | 2001-12-18 |
| 6312551 | Method for mounting semiconductor chip onto circuit board | Kei Murayama | 2001-11-06 |
| 6281567 | Substrate for mounting semiconductor chip with parallel conductive lines | Kei Murayama | 2001-08-28 |
| 6147311 | Multi layer circuit board using anisotropic electroconductive adhesive layer and method for producing same | — | 2000-11-14 |