Issued Patents All Time
Showing 76–93 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9911712 | Clip and related methods | Atapol Prajuckamol, Yushuang YAO | 2018-03-06 |
| 9748163 | Die support for enlarging die size | Soon Wei WANG, How Kiat Liew, Francis J. Carney | 2017-08-29 |
| 9691732 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2017-06-27 |
| 9679878 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Azhar Aripin | 2017-06-13 |
| 9620877 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Atapol Prajuckamol | 2017-04-11 |
| 9570832 | Press-fit pin for semiconductor packages and related methods | Atapol Prajuckamol, Yusheng LIN | 2017-02-14 |
| 9431311 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2016-08-30 |
| D755742 | Power device package | Atapol Prajuckamol, Yushuang YAO | 2016-05-10 |
| D755741 | Power device package | Atapol Prajuckamol, Yushuang YAO | 2016-05-10 |
| 8519521 | Electronic device including a packaging substrate having a trench | Shutesh Krishnan, Jatinder Kumar | 2013-08-27 |
| 8268676 | Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads | Shutesh Krishnan, Jatinder Kumar | 2012-09-18 |
| 7736951 | Circuit component and method of manufacture | Atapol Prajuckamol, Khiengkrai KHUSUWAN | 2010-06-15 |
| 6475834 | Method of manufacturing a semiconductor component and semiconductor component thereof | Saat Shukri Embong, Dave Culbertson | 2002-11-05 |
| 6472731 | Solder clad lead frame for assembly of semiconductor devices and method | — | 2002-10-29 |
| 6392288 | Lead frame for assembly for thin small outline plastic encapsulated packages | Aik Chong Tan, Shan Chong Tan | 2002-05-21 |
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Kenneth Teik Kheong Low, Saat Shukri Embong, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |
| 5973388 | Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe | Hin Kooi Chee, Saat Shukri Embong | 1999-10-26 |
| 5920113 | Leadframe structure having moveable sub-frame | Hin Kooi Chee, Hou Boon Tan, Robert J. McLaughlin, David M. Culbertson, Alex Elliott +1 more | 1999-07-06 |