Issued Patents All Time
Showing 26–50 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830856 | Semiconductor package and related methods | Erik Nino Tolentino, Vemmond Jeng Hung NG, Shutesh Krishnan | 2023-11-28 |
| 11804421 | Connecting clip design for pressure sintering | Atapol Prajuckamol, Yushuang YAO | 2023-10-31 |
| 11791288 | Reinforced semiconductor die and related methods | Erik Nino Tolentino, Yusheng LIN, Swee Har KHOR | 2023-10-17 |
| 11710687 | Semiconductor package with guide pin | Yushuang YAO, Atapol Prajuckamol, Chuncao NIU | 2023-07-25 |
| 11672087 | Semiconductor package | Atapol Prajuckamol, Yushuang YAO | 2023-06-06 |
| 11569140 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2023-01-31 |
| 11562938 | Spacer with pattern layout for dual side cooling power module | Yong Liu, Liangbiao CHEN, Yusheng LIN | 2023-01-24 |
| 11557530 | Semiconductor devices and methods of making the same | Swee Har KHOR, Tian Hing Lim, Hui Min LER, Phillip Celaya | 2023-01-17 |
| 11532539 | Semiconductor package with wettable flank | Hui Min LER, Soon Wei WANG | 2022-12-20 |
| 11508679 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Francis J. Carney | 2022-11-22 |
| 11482468 | Power module package casing with protrusion supports | Yushuang YAO, Vemmond Jeng Hung NG, Qing Yang | 2022-10-25 |
| 11469163 | Low stress asymmetric dual side module | Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN | 2022-10-11 |
| 11462515 | Low stress asymmetric dual side module | Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN | 2022-10-04 |
| 11452225 | Fin frame assemblies | Atapol Prajuckamol, Yushuang YAO | 2022-09-20 |
| 11437304 | Substrate structures and methods of manufacture | Yusheng LIN, Roger P. Stout, Sadamichi Takakusaki, Francis J. Carney | 2022-09-06 |
| 11404277 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11404276 | Semiconductor packages with thin die and related methods | Francis J. Carney, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11373939 | Quad leadframe packages and related methods | Jinchang ZHOU, Asif Y. Jakwani, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO | 2022-06-28 |
| 11374373 | Press-fit pin for semiconductor packages and related methods | Atapol Prajuckamol, Yusheng LIN | 2022-06-28 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Michael J. Seddon, Francis J. Carney, Eiji KUROSE, Soon Wei WANG | 2022-06-14 |
| 11348878 | Reinforced semiconductor die and related methods | Erik Nino Tolentino, Yusheng LIN, Swee Har KHOR | 2022-05-31 |
| 11348796 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE | 2022-05-31 |
| 11342237 | Semiconductor package system and related methods | Yushuang YAO, Atapol Prajuckamol | 2022-05-24 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE | 2022-05-24 |
| 11272625 | Method for forming a semiconductor package | Atapol Prajuckamol, Yushuang YAO | 2022-03-08 |