Issued Patents All Time
Showing 51–75 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217506 | Semiconductor device assemblies including low-stress spacer | Atapol Prajuckamol | 2022-01-04 |
| 10971428 | Semiconductor baseplates | Atapol Prajuckamol, Francis J. Carney, Yushuang YAO | 2021-04-06 |
| 10966335 | Fin frame assemblies | Atapol Prajuckamol, Yushuang YAO | 2021-03-30 |
| 10916485 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Francis J. Carney | 2021-02-09 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Francis J. Carney, Yusheng LIN | 2021-01-19 |
| 10861767 | Package structure with multiple substrates | Atapol Prajuckamol, Yushuang YAO | 2020-12-08 |
| 10861775 | Connecting clip design for pressure sintering | Atapol Prajuckamol, Yushuang YAO | 2020-12-08 |
| 10825748 | Semiconductor package system and related methods | Yushuang YAO, Atapol Prajuckamol | 2020-11-03 |
| 10825786 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Francis J. Carney | 2020-11-03 |
| 10756006 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Soon Wei WANG | 2020-08-25 |
| 10727170 | Semiconductor devices and methods of making the same | Swee Har KHOR, Tian Hing Lim, Hui Min LER, Phillip Celaya | 2020-07-28 |
| 10720725 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Atapol Prajuckamol | 2020-07-21 |
| 10700018 | Reinforced semiconductor die and related methods | Erik Nino Tolentino, Yusheng LIN, Swee Har KHOR | 2020-06-30 |
| 10693270 | Press-fit pin for semiconductor packages and related methods | Atapol Prajuckamol, Yusheng LIN | 2020-06-23 |
| 10607903 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2020-03-31 |
| 10559510 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Francis J. Carney | 2020-02-11 |
| 10559905 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Atapol Prajuckamol | 2020-02-11 |
| 10319652 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2019-06-11 |
| 10283466 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Francis J. Carney | 2019-05-07 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Francis J. Carney, Yusheng LIN | 2019-03-12 |
| 10224655 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Atapol Prajuckamol | 2019-03-05 |
| 10199311 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Soon Wei WANG | 2019-02-05 |
| 10121763 | Clip and related methods | Atapol Prajuckamol, Yushuang YAO | 2018-11-06 |
| 9967986 | Semiconductor package and method therefor | Atapol Prajuckamol, Yushuang YAO | 2018-05-08 |
| 9941257 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Azhar Aripin | 2018-04-10 |