Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923407 | Semiconductor device | Sundae KIM, Yun-Rae Cho, Namgyu Baek | 2021-02-16 |
| 10879187 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk, Seung-Kwan Ryu | 2020-12-29 |
| 10879292 | Semiconductor package and method of manufacturing the same | Jaegwon Jang, Kyoung Lim Suk | 2020-12-29 |
| 10861927 | Electro-luminescent display device with improved contact structure | Sangmoo Park, WonJune Jung | 2020-12-08 |
| 10756015 | Semiconductor package, package-on-package device, and method of fabricating the same | Kyung Suk Oh | 2020-08-25 |
| 10741518 | Method of fabricating semiconductor package | Youn-ji Min, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2020-08-11 |
| 10685890 | Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same | Jongyoun Kim | 2020-06-16 |
| 10546829 | Method of fabricating semiconductor package | Youn-ji Min, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2020-01-28 |
| 10541201 | Semiconductor package, package-on-package device, and method of fabricating the same | Kyung Suk Oh | 2020-01-21 |
| 10522471 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2019-12-31 |
| 10319650 | Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same | Jongyoun Kim | 2019-06-11 |
| 9716048 | Semiconductor device having a peripheral-region defect detection structure | Sundae KIM, Yun-Rae Cho, Namgyu Baek | 2017-07-25 |
| 9640513 | Semiconductor package and method of fabricating the same | Chul-Yong Jang, Jongho Lee | 2017-05-02 |
| 9364914 | Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball | Jaegwon Jang, Chul-Yong Jang | 2016-06-14 |
| 9343437 | Semiconductor package devices | Ae-Nee Jang, Jin-Woo Park, Jongho Lee | 2016-05-17 |
| 9202716 | Methods of fabricating fan-out wafer level packages and packages formed by the methods | Jin-Woo Park, Hogeon Song | 2015-12-01 |
| 9087883 | Method and apparatus for stacked semiconductor chips | Jin-Woo Park, Taesung Park | 2015-07-21 |
| 8890333 | Apparatus for stacked semiconductor chips | Jin-Woo Park, Taesung Park | 2014-11-18 |