Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837551 | Semiconductor package | Jongyoun Kim, Gwangjae Jeon | 2023-12-05 |
| 11810915 | Semiconductor package with redistribution substrate having embedded passive device | Kyoung Lim Suk, Jaegwon Jang | 2023-11-07 |
| 11804427 | Semiconductor package | Dongkyu Kim, Kyoung Lim Suk, Jaegwon Jang, Gwangjae Jeon | 2023-10-31 |
| 11705341 | Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layers | Gwangjae Jeon | 2023-07-18 |
| 11694936 | Semiconductor package and method of fabricating the same | Minjung Kim, Kyoung Lim Suk | 2023-07-04 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Yeonho Jang, Jaegwon Jang | 2023-04-25 |
| 11626393 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2023-04-11 |
| 11626354 | Method of manufacturing redistribution substrate | — | 2023-04-11 |
| 11616051 | Semiconductor package device | Dongkyu Kim, Yeonho Jang, Jaegwon Jang | 2023-03-28 |
| 11610785 | Semiconductor packages | Kyoung Lim Suk, Ae-Nee Jang, Jaegwon Jang | 2023-03-21 |
| 11605584 | Semiconductor package | Kyoung Lim Suk, Keung Beum Kim, Dongkyu Kim, Minjung Kim | 2023-03-14 |
| 11600564 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Minjun Bae | 2023-03-07 |
| 11538798 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Jaegwon Jang | 2022-12-27 |
| 11456241 | Semiconductor package | Jongyoun Kim, Yeonho Jang, Jaegwon Jang | 2022-09-27 |
| 11348876 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk, Seung-Kwan Ryu | 2022-05-31 |
| 11348864 | Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same | Gwangjae Jeon | 2022-05-31 |
| 11282995 | Display module package | Dahye Kim, Jungho Park | 2022-03-22 |
| 11145611 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Yeonho Jang, Jaegwon Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Jaegwon Jang, Inwon O, Jongyoun Kim, Yeonho Jang | 2021-08-17 |
| 11075149 | Redistribution substrate, method of manufacturing the same, and semiconductor package including the same | — | 2021-07-27 |
| 11056461 | Method of manufacturing fan-out wafer level package | Yeonho Jang, Gwangjae Jeon, Dongkyu Kim, Jungho Park | 2021-07-06 |
| 11018108 | Method of fabricating semiconductor package | Youn-ji Min, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2021-05-25 |
| 10964643 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2021-03-30 |
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Minjun Bae | 2021-03-16 |
| 10930625 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2021-02-23 |