Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7109575 | Low-cost flexible film package module and method of manufacturing the same | Dong-Han Kim, Ye-Chung Chung | 2006-09-19 |
| 7078331 | Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same | Yong-Hwan Kwon, Chung-Sun Lee | 2006-07-18 |
| 7074704 | Bump formed on semiconductor device chip and method for manufacturing the bump | Yong-Hwan Kwon | 2006-07-11 |
| 6902261 | Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly | Jeong-seon Kim, Seo-hyun Cho, Dae-Woo Son, Myung-song Jung | 2005-06-07 |
| 6903451 | Chip scale packages manufactured at wafer level | Nam-Seog Kim, Dong-Hyeon Jang, Heung-Kyu Kwon | 2005-06-07 |
| 6849802 | Semiconductor chip, chip stack package and manufacturing method | Young-Hee Song, Min Young Son | 2005-02-01 |
| 6836018 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Min Young Son | 2004-12-28 |
| 6818998 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Yong-Hwan Kwon, Se-Yong Oh | 2004-11-16 |
| 6791196 | Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same | Dong-Whee Kwon, Jin Hyuk Lee, Yun Heub Song | 2004-09-14 |
| 6717272 | Reinforced bond-pad substructure and method for fabricating the same | Jin Hyuk Lee, Dong-Whee Kwon, Ji-Yong You, Hye-Soo Shin | 2004-04-06 |
| 6607938 | Wafer level stack chip package and method for manufacturing same | Yong-Hwan Kwon, Dong-Hyeon Jang, Min Kyo Cho, Gu-Sung Kim | 2003-08-19 |
| 6586275 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Min Young Son | 2003-07-01 |
| 6555921 | Semiconductor package | Yong-Hwan Kwon, Nam-Seog Kim, Dong-Hyeon Jang | 2003-04-29 |
| 6518675 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Min Young Son | 2003-02-11 |
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Myung-Kee Chung, In-Ku Kang, Kwan-Jai Lee | 2002-09-10 |
| 6407459 | Chip scale package | Yong-Hwan Kwon | 2002-06-18 |
| 6376279 | method for manufacturing a semiconductor package | Yong-Hwan Kwon, Nam-Seog Kim, Dong-Hyeon Jang | 2002-04-23 |
| 6235552 | Chip scale package and method for manufacturing the same using a redistribution substrate | Yong-Hwan Kwon | 2001-05-22 |
| 6187615 | Chip scale packages and methods for manufacturing the chip scale packages at wafer level | Nam-Seog Kim, Dong-Hyeon Jang, Heung-Kyu Kwon | 2001-02-13 |