Issued Patents All Time
Showing 26–50 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325855 | Backside drill embedded die substrate | Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Manuel Aldrete, Chengjie Zuo +2 more | 2019-06-18 |
| 10290414 | Substrate comprising an embedded inductor and a thin film magnetic core | Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy, Je-Hsiung Lan +3 more | 2019-05-14 |
| 10283257 | Skewed co-spiral inductor structure | David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim | 2019-05-07 |
| 10269808 | Semiconductor devices and methods of forming semiconductor devices | Bong-Soo Kim, Jemin Park, Taejin Park, Yoosang Hwang | 2019-04-23 |
| 10262786 | Stepped-width co-spiral inductor structure | Babak Nejati, Husnu Ahmet Masaracioglu | 2019-04-16 |
| 10249580 | Stacked substrate inductor | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim | 2019-04-02 |
| 10242957 | Compartment shielding in flip-chip (FC) module | Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo, Jonghae Kim +1 more | 2019-03-26 |
| 10187031 | Tunable matching network | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +4 more | 2019-01-22 |
| 10171112 | RF multiplexer with integrated directional couplers | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +4 more | 2019-01-01 |
| 10154591 | Passive device assembly for accurate ground plane control | Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim | 2018-12-11 |
| 10141353 | Passive components implemented on a plurality of stacked insulators | Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy | 2018-11-27 |
| 10103703 | Double-sided circuit | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez +2 more | 2018-10-16 |
| 10103116 | Open-passivation ball grid array pads | Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo, David Francis Berdy, Jonghae Kim +1 more | 2018-10-16 |
| 10074625 | Wafer level package (WLP) ball support using cavity structure | Mario Francisco Velez, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo +3 more | 2018-09-11 |
| 10069474 | Encapsulation of acoustic resonator devices | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Je-Hsiung Lan +4 more | 2018-09-04 |
| 10051741 | Embedded layered inductor | Young Kyu Song, Xiaonan Zhang, Ryan David Lane, Jonghae Kim | 2018-08-14 |
| 10049815 | Nested through glass via transformer | Jonghae Kim, Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun | 2018-08-14 |
| 10037996 | Semiconductor device includes a substrate having conductive contact structures thereon | Bong-Soo Kim, Jemin Park, Yoosang Hwang | 2018-07-31 |
| 10026546 | Apparatus with 3D wirewound inductor integrated within a substrate | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim +1 more | 2018-07-17 |
| 10023627 | Vascular endothelial growth factor fusion protein | Inra SEO | 2018-07-17 |
| 9966426 | Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications | Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan, Chengjie Zuo +3 more | 2018-05-08 |
| 9960170 | Methods of fabricating memory devices | Kiseok Lee, Keunnam Kim, Bong-Soo Kim, Jemin Park, Chan Yoon +1 more | 2018-05-01 |
| 9959964 | Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Jonghae Kim, Je-Hsiung Lan +2 more | 2018-05-01 |
| 9954267 | Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter | Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy, Jonghae Kim | 2018-04-24 |
| 9935166 | Capacitor with a dielectric between a via and a plate of the capacitor | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Robert Paul Mikulka +2 more | 2018-04-03 |