Issued Patents All Time
Showing 76–100 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478348 | Vertical spiral inductor | Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy, Jonghae Kim | 2016-10-25 |
| 9468098 | Face-up substrate integration with solder ball connection in semiconductor package | Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka | 2016-10-11 |
| 9461614 | Asymmetric unbalanced acoustically coupled resonators for spurious mode suppression | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim | 2016-10-04 |
| 9449753 | Varying thickness inductor | Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang +2 more | 2016-09-20 |
| 9425761 | High pass filters and low pass filters using through glass via technology | Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Mario Francisco Velez, Je-Hsiung Lan +2 more | 2016-08-23 |
| 9384883 | Nested through glass via transformer | Jonghae Kim, Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun | 2016-07-05 |
| 9379686 | Resonator with a staggered electrode configuration | Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Rick A. Wilcox | 2016-06-28 |
| 9368564 | 3D pillar inductor | Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Mario Francisco Velez | 2016-06-14 |
| 9370103 | Low package parasitic inductance using a thru-substrate interposer | Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez | 2016-06-14 |
| 9368566 | Package on package (PoP) integrated device comprising a capacitor in a substrate | Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei-Ming Jow, Mario Francisco Velez +3 more | 2016-06-14 |
| 9361160 | Virtualization across physical partitions of a multi-core processor (MCP) | Karl J. Duvalsaint, Harm Peter Hofstee, Moon J. Kim | 2016-06-07 |
| 9362218 | Integrated passive device (IPD) on substrate | Young Kyu Song, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +2 more | 2016-06-07 |
| 9355967 | Stress compensation patterning | Je-Hsiung Lan, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun | 2016-05-31 |
| 9343399 | Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez +2 more | 2016-05-17 |
| 9343403 | Stress mitigation structure for wafer warpage reduction | Je-Hsiung Lan, David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez +3 more | 2016-05-17 |
| 9337199 | Semiconductor device and method of fabricating the same | Jiyoung Kim, Sungho Jang, Kang-Uk Kim, Kyung Eun Kim, Hyoungsub Kim +4 more | 2016-05-10 |
| 9324779 | Toroid inductor in an integrated device | Young Kyu Song, Jonghae Kim, Xiaonan Zhang, Ryan David Lane, Mario Francisco Velez +2 more | 2016-04-26 |
| 9275786 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +1 more | 2016-03-01 |
| 9264013 | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods | Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Changhan Hobie Yun, Je-Hsiung Lan +2 more | 2016-02-16 |
| 9202789 | Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package | Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak, Chengjie Zuo, Changhan Hobie Yun +2 more | 2015-12-01 |
| 9203373 | Diplexer design using through glass via technology | Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Lan, Changhan Hobie Yun +5 more | 2015-12-01 |
| 9189057 | Adaptive real-time power and performance optimization of multi-core processors | Jonghae Kim, Moon J. Kim, James R. Moulic | 2015-11-17 |
| 9184136 | Semiconductor devices and methods for fabricating the same | Jiyoung Kim, Kang-Uk Kim, Nara Kim, Jemin Park, Kyuhyun Lee +4 more | 2015-11-10 |
| 9177923 | Through-substrate via shielding | Chandrasekharan Kothandaraman, Chung-Hsun Lin, John M. Safran | 2015-11-03 |
| 9140747 | Sense amplifier offset voltage reduction | Jung Pill Kim, Taehyun Kim, Sungryul Kim | 2015-09-22 |