Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mechanisms for forming hybrid bonding structures with elongated bumps

Mechanisms for forming hybrid bonding structures with elongated bumps

US Patent 10867957 · Granted Dec 15, 2020

Estimated economic value: $3,031,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Current sensing circuit using proportional current mirrors2025
Polymer layers embedded with metal pads for heat dissipation2025
Polymer layers embedded with metal pads for heat dissipation2025
Polymer layers embedded with metal pads for heat dissipation2025
Stacked memory cube with integrated thermal path for enhanced heat dissipation2025
Semiconductor structure and manufacturing method thereof2025
Packages for semiconductor devices, packaged semiconductor devices, and methods 2025
Multilayer stacking wafer bonding structure and method of manufacturing the same2025
Wafer structure including probe marked test pads2025
Semiconductor package structure and manufacturing method thereof2025
Methods and apparatus for package with interposers2025
Methods and apparatus for package with interposers2025