Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices

US Patent 12374652 · Granted Jul 29, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure and manufacturing method thereof2025
Methods and apparatus for package with interposers2025
Method of manufacturing die stack structure2025
Conductive bump of a semiconductor device and fabricating method thereof cross r2025
Semiconductor package with shared barrier layer in redistribution and via and me2025
Semiconductor structure including interconnection to probe pad with probe mark2025
Semiconductor structure having an anti-arcing pattern disposed on a passivation 2024
Semiconductor package and manufacturing method thereof2024
Semiconductor devices and methods of manufacturing2024
Semiconductor packages and forming methods thereof2024
Manufacturing method of a semiconductor device2024
Methods of manufacturing a semiconductor device including a joint adjacent to a 2024