Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3D printed chamber components configured for lower film stress and lower operating temperature

3D printed chamber components configured for lower film stress and lower operating temperature

US Patent 10777391 · Granted Sep 15, 2020

Estimated economic value: $35,161,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Eco-efficiency (sustainability) dashboard for semiconductor manufacturing2025
Substrate support with real time force and film stress control2025
Cooling flow in substrate processing according to predicted cooling parameters2025
Heated substrate support2025
Eco-efficiency monitoring and exploration platform for semiconductor manufacturi2025
Methods for shaping magnetic fields during semiconductor processing2025
Substrate support designs for a deposition chamber2025
Carrier head membrane with regions of different roughness2024
Etch uniformity improvement for single turn internal coil PVD chamber2024
Apparatus for generating magnetic fields on substrates during semiconductor proc2024
Conical coil for rapid thermal anneal lamps2024
Eco-efficiency (sustainability) dashboard for semiconductor manufacturing2024