Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7440834 | Drive force distribution system for four wheel independent drive vehicle | Yoshitaka Deguchi, Hideaki Inoue | 2008-10-21 |
| 7055636 | Drive control device for hybrid vehicle | Susumu Komiyama, Hideaki Inoue, Hiroshi Iwano, Taketora Negome | 2006-06-06 |
| 6897142 | Formation of solder balls having resin member as reinforcement | Joji Fujimori | 2005-05-24 |
| 6889126 | Drive force control for hybrid electric vehicle | Susumu Komiyama, Hiroshi Iwano, Hideaki Inoue | 2005-05-03 |
| 6689639 | Method of making semiconductor device | Seiki Sakuyama, Masayuki Ochiai, Joji Fujimori | 2004-02-10 |
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Kazuhiko Mitobe, Koki Otake +4 more | 2003-03-04 |
| 6502384 | Side thruster of flying object | Noboru Onojima, Hitoshi Tezuka, Akira Osada | 2003-01-07 |
| 6319810 | Method for forming solder bumps | Masayuki Ochiai, Yasuo Yamagishi, Masahiro Yoshikawa, Koki Otake, Masataka Mizukoshi +1 more | 2001-11-20 |
| 6271110 | Bump-forming method using two plates and electronic device | Koki Otake, Masahiro Yoshikawa | 2001-08-07 |
| 6090301 | Method for fabricating bump forming plate member | Masataka Mizukoshi, Masahiro Yoshikawa, Koki Otake, Junichi Kasai | 2000-07-18 |
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Kazuhiko Mitobe, Koki Otake +4 more | 2000-02-15 |
| 6022759 | Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Michio Sono, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake +5 more | 2000-02-08 |
| 5920117 | Semiconductor device and method of forming the device | Michio Sono, Masashi Takenaka, Masanori Yoshimoto, Tsuyoshi Aoki, Koki Otake | 1999-07-06 |
| 5804468 | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Toshio Hamano +5 more | 1998-09-08 |
| 5747874 | Semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Michio Sono, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake +5 more | 1998-05-05 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Kazuhiko Mitobe, Koki Otake +6 more | 1997-07-01 |
| 5497032 | Semiconductor device and lead frame therefore | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Toshio Hamano +5 more | 1996-03-05 |
| 5091770 | Semiconductor device having a ceramic package | — | 1992-02-25 |