Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004085 | Semiconductor device and method of manufacturing semiconductor device | Shintaro Yamamichi, Jun Sakai, Hikaru Kouta | 2011-08-23 |
| 8004074 | Semiconductor device and fabrication method | Kentaro Mori, Shintaro Yamamichi | 2011-08-23 |
| 7911038 | Wiring board, semiconductor device using wiring board and their manufacturing methods | Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori, Takehiko Maeda +3 more | 2011-03-22 |
| 7889514 | Wiring board, semiconductor device, and method of manufacturing the same | Shintaro Yamamichi, Yoichiro Kurita, Koji Soejima | 2011-02-15 |
| 7880295 | Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same | Shintaro Yamamichi, Yoichiro Kurita, Koji Soejima | 2011-02-01 |
| 7838779 | Wiring board, method for manufacturing same, and semiconductor package | Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Takehiko Maeda, Kenta Ogawa +2 more | 2010-11-23 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Shintaro Yamamichi, Kazuhiro Baba +4 more | 2010-10-19 |
| 7791186 | Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same | Shintaro Yamamichi, Yoichiro Kurita, Koji Soejima | 2010-09-07 |
| 7784653 | Discharge device and discharge method | — | 2010-08-31 |
| 7701726 | Method of manufacturing a wiring substrate and semiconductor device | Jun Tsukano, Kenta Ogawa, Takehiko Maeda, Shintaro Yamamichi | 2010-04-20 |
| 7696007 | Semiconductor package board using a metal base | Tadanori Shimoto, Koji Matsui, Kazuhiro Baba | 2010-04-13 |
| 7674989 | Wiring board and method for manufacturing the same | Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Takehiko Maeda, Hirokazu Honda +2 more | 2010-03-09 |
| 7652375 | Semiconductor device and method of manufacturing the same | Koji Soejima, Yoichiro Kurita, Masaya Kawano, Shintaro Yamamichi | 2010-01-26 |
| 7649749 | Wiring substrate, semiconductor device, and method of manufacturing the same | Jun Tsukano, Kenta Ogawa, Takehiko Maeda, Shintaro Yamamichi | 2010-01-19 |
| 7585699 | Semiconductor package board using a metal base | Tadanori Shimoto, Koji Matsui, Kazuhiro Baba | 2009-09-08 |
| 7566834 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Hideya Murai, Kazuhiro Baba, Hirokazu Honda, Keiichiro Kata | 2009-07-28 |
| 7474538 | Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package | Tadanori Shimoto, Kazuhiro Baba | 2009-01-06 |
| 7397000 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Hideya Murai, Kazuhiro Baba, Hirokazu Honda, Keiichiro Kata | 2008-07-08 |
| 7348673 | Semiconductor device | Shintaro Yamamichi, Hideya Murai, Hirokazu Honda, Koji Soejima, Shinichi Miyazaki | 2008-03-25 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device | Tadanori Shimoto, Koji Matsui, Kazuhiro Baba | 2008-03-04 |
| 7294393 | Sheet material and wiring board | Hideya Murai, Tadanori Shimoto, Kazuhiro Baba | 2007-11-13 |
| 7233066 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Hirokazu Honda, Kazuhiro Baba, Tadanori Shimoto, Rokuro Kambe +2 more | 2007-06-19 |
| 7060604 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Hirokazu Honda, Kazuhiro Baba, Tadanori Shimoto, Rokuro Kambe +2 more | 2006-06-13 |
| 6960258 | Discharge device and discharge method | — | 2005-11-01 |
| 6861757 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device | Tadanori Shimoto, Koji Matsui, Kazuhiro Baba | 2005-03-01 |