Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10737580 | Vehicle | Yuji Aiuchi | 2020-08-11 |
| 10732638 | Sub-mobility device charging system for vehicle | Yuji Aiuchi | 2020-08-04 |
| 10649456 | Sub-mobility device charging system for vehicle | Yuji Aiuchi | 2020-05-12 |
| D784618 | Electric hair clipper | Kyohei Mori | 2017-04-18 |
| D784619 | Electric hair clipper | Kyohei Mori | 2017-04-18 |
| 8939112 | Buckstay connecting system | — | 2015-01-27 |
| 8929090 | Functional element built-in substrate and wiring substrate | Yoshiki Nakashima, Shintaro Yamamichi, Kentaro Mori, Hideya Murai | 2015-01-06 |
| D718900 | Electric shaver | Kensaku Okabe | 2014-12-02 |
| D717996 | Electric shaver | — | 2014-11-18 |
| 8872334 | Method for manufacturing semiconductor device | Shintaro Yamamichi, Yoshiki Nakashima, Kentaro Mori | 2014-10-28 |
| 8810008 | Semiconductor element-embedded substrate, and method of manufacturing the substrate | Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Yoshiki Nakashima, Daisuke Ohshima | 2014-08-19 |
| 8766440 | Wiring board with built-in semiconductor element | Shintaro Yamamichi, Hideya Murai, Kentaro Mori, Yoshiki Nakashima, Daisuke Ohshima | 2014-07-01 |
| 8710639 | Semiconductor element-embedded wiring substrate | Shintaro Yamamichi, Hideya Murai, Kentaro Mori, Yoshiki Nakashima | 2014-04-29 |
| 8710669 | Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer | Kentaro Mori, Yoshiki Nakashima, Daisuke Ohshima, Shintaro Yamamichi | 2014-04-29 |
| 8692364 | Semiconductor device and method for manufacturing the same | Yoshiki Nakashima, Kentaro Mori, Shintaro Yamamichi | 2014-04-08 |
| 8569892 | Semiconductor device and manufacturing method thereof | Kentaro Mori, Daisuke Ohshima, Shintaro Yamamichi, Hideya Murai, Katsumi Maeda +1 more | 2013-10-29 |
| 8552570 | Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device | Shintaro Yamamichi, Masaya Kawano, Kouji Soejima, Yoichiro Kurita | 2013-10-08 |
| 8536691 | Semiconductor device and method for manufacturing the same | Shintaro Yamamichi, Hideya Murai, Katsumi Maeda, Takuo Funaya, Kentaro Mori +3 more | 2013-09-17 |
| 8389414 | Method of manufacturing a wiring board | Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori, Takehiko Maeda +3 more | 2013-03-05 |
| 8198140 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Shintaro Yamamichi, Kazuhiro Baba +4 more | 2012-06-12 |
| 8148816 | Semiconductor device | Hideki Sasaki, Yuuki Fujimura | 2012-04-03 |
| 8072073 | Semiconductor device and method of manufacturing same | Shintaro Yamamichi, Masaya Kawano, Kouji Soejima | 2011-12-06 |
| 8050050 | Wiring board, semiconductor device, and method of manufacturing the same | Shintaro Yamamichi, Yoichiro Kurita, Koji Soejima | 2011-11-01 |
| 8039756 | Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same | Shintaro Yamamichi, Yoichiro Kurita, Koji Soejima | 2011-10-18 |
| 8030201 | Semiconductor device and method of manufacturing the same | Koji Soejima, Yoichiro Kurita, Masaya Kawano, Shintaro Yamamichi | 2011-10-04 |