Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5885870 | Method for forming a semiconductor device having a nitrided oxide dielectric layer | Bikas Maiti, Sergio A. Ajuria | 1999-03-23 |
| 5830802 | Process for reducing halogen concentration in a material layer during semiconductor device fabrication | Hsing-Huang Tseng, Bikas Maiti | 1998-11-03 |
| 5726087 | Method of formation of semiconductor gate dielectric | Hsing-Huang Tseng | 1998-03-10 |
| 5712208 | Methods of formation of semiconductor composite gate dielectric having multiple incorporated atomic dopants | Hsing-Huang Tseng, Keith E. Witek | 1998-01-27 |
| 5707889 | Process for forming field isolation | Ting-Chen Hsu, Laureen H. Parker, David G. Kolar, Hsing-Huang Tseng, Lisa K. Garling +1 more | 1998-01-13 |
| 5580815 | Process for forming field isolation and a structure over a semiconductor substrate | Ting-Chen Hsu, Laureen H. Parker, David G. Kolar, Hsing-Huang Tseng, Lisa K. Garling +1 more | 1996-12-03 |
| 5571734 | Method for forming a fluorinated nitrogen containing dielectric | Hsing-Huang Tseng | 1996-11-05 |
| 5552332 | Process for fabricating a MOSFET device having reduced reverse short channel effects | Hsing-Huang Tseng, Paul G. Y. Tsui, Shih-Wei Sun, Stephen S. Poon | 1996-09-03 |
| 5543635 | Thin film transistor and method of formation | Bich-Yen Nguyen, Thomas F. McNelly, James D. Hayden | 1996-08-06 |
| 5539216 | Monolithic semiconductor body with convex structure | Bich-Yen Nguyen, Marius Orlowski, Jim Hayden, Jack M. Higman | 1996-07-23 |
| 5510278 | Method for forming a thin film transistor | Bich-Yen Nguyen, Thomas F. McNelly, James D. Hayden | 1996-04-23 |
| 5464792 | Process to incorporate nitrogen at an interface of a dielectric layer in a semiconductor device | Hsing-Huang Tseng | 1995-11-07 |
| 5407870 | Process for fabricating a semiconductor device having a high reliability dielectric material | Yoshio Okada | 1995-04-18 |
| 5371035 | Method for forming electrical isolation in an integrated circuit device | James R. Pfiester | 1994-12-06 |
| 5352615 | Denuding a semiconductor substrate | Young Limb | 1994-10-04 |
| 5300187 | Method of removing contaminants | Israel A. Lesk, Young Limb, John G. Franka, Paul T. Lin, Jonathan C. Dahm +2 more | 1994-04-05 |
| 5208189 | Process for plugging defects in a dielectric layer of a semiconductor device | Bich-Yen Nguyen | 1993-05-04 |
| 4987102 | Process for forming high purity thin films | Bich-Yen Nguyen, Jen-Jiang Lee, Hoang K. Nguyen, Young Limb | 1991-01-22 |
| 4927780 | Encapsulation method for localized oxidation of silicon | Scott S. Roth, Bich-Yen Nguyen, Wayne J. Ray, E. Petyr Wachholz, Glenn Wissen | 1990-05-22 |
| 4914046 | Polycrystalline silicon device electrode and method | Bich-Yen Nguyen, Fabio Pintchovski | 1990-04-03 |
| 4897364 | Method for locos isolation using a framed oxidation mask and a polysilicon buffer layer | Bich-Yen Nguyen, Shih-Wei Sun, Michael P. Woo | 1990-01-30 |
| 4822753 | Method for making a w/tin contact | Faivel Pintchovski | 1989-04-18 |
| 4819040 | Epitaxial CMOS by oxygen implantation | — | 1989-04-04 |
| 4740483 | Selective LPCVD tungsten deposition by nitridation of a dielectric | — | 1988-04-26 |
| 4605947 | Titanium nitride MOS device gate electrode and method of producing | J. B. Price, Fabio Pintchovski, Christian A. Seelbach | 1986-08-12 |