Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6339257 | Semiconductor device | Noriaki Fujiki, Takashi Yamashita, Kazunobu Miki | 2002-01-15 |
| 6283835 | Method and apparatus for manufacturing a semiconductor integrated circuit | Takashi Yamashita, Noriaki Fujiki, Tsutomu Tanaka | 2001-09-04 |
| 6259426 | Video image display apparatus and method | Junji Kagita, Yoshihito Osawa, Kazuhiko Fujihara | 2001-07-10 |
| 6201566 | Video display method and video display apparatus | Junji Kagita, Yoshihito Ohsawa, Kazuhiko Fujihara | 2001-03-13 |
| 6178972 | Method and apparatus for manufacturing a semiconductor integrated circuit | Takashi Yamashita, Noriaki Fujiki, Tsutomu Tanaka | 2001-01-30 |
| 6130481 | Semiconductor integrated circuit interconnection structures and method of making the interconnection structures | Kenji Kishibe, Akira Ihisa, Hiroshi Mochizuki, Eisuke Tanaka | 2000-10-10 |
| 6046488 | Semiconductor device having conductive layer and manufacturing method thereof | Takahiro Kawasaki, Hiroshi Tobimatsu | 2000-04-04 |
| 6013951 | Semiconductor device having an improved lead connection structure and manufacturing method thereof | Tomohiro Ishida, Takashi Yamashita | 2000-01-11 |
| 5976626 | Semiconductor device and method of manufacturing thereof | Junko Matsubara, Toru Tajima | 1999-11-02 |
| 5889330 | Semiconductor device whose flattening resin film component has a controlled carbon atom content | Hiroyuki Nishimura, Hiroshi Adachi, Etsushi Adachi, Shigeyuki Yamamoto, Shintaro Minami +2 more | 1999-03-30 |
| 5728630 | Method of making a semiconductor device | Hiroyuki Nishimura, Hiroshi Adachi, Etsushi Adachi, Shigeyuki Yamamoto, Shintaro Minami +2 more | 1998-03-17 |
| 5712509 | Semiconductor integrated circuit interconnection structures | Kenji Kishibe, Akira Ohisa, Hiroshi Mochizuki, Eisuke Tanaka | 1998-01-27 |
| 5604380 | Semiconductor device having a multilayer interconnection structure | Hiroyuki Nishimura, Hiroshi Adachi, Etsushi Adachi, Shigeyuki Yamamoto, Shintaro Minami +2 more | 1997-02-18 |
| 5565378 | Process of passivating a semiconductor device bonding pad by immersion in O.sub.2 or O.sub.3 solution | Kimio Hagi, Kiyoaki Tsumura | 1996-10-15 |
| 5525546 | Semiconductor device and method of manufacturing thereof | Takemi Endoh, Tomohiro Ishida | 1996-06-11 |
| 5510653 | Semiconductor device including silicon ladder resin layer | Noriaki Fujiki, Hiroshi Adachi, Etsushi Adachi | 1996-04-23 |
| 5497403 | Feedback clamping circuit | Yoshihide Nagatsu | 1996-03-05 |
| 5488014 | Interconnection structure of semiconductor integrated circuit device and manufacturing method thererfor | Junichi Arima, Noriaki Fujiki | 1996-01-30 |
| 5481137 | Semiconductor device with improved immunity to contact and conductor defects | Hisao Masuda, Reiji Tamaki | 1996-01-02 |
| 5480836 | Method of forming an interconnection structure | Kazuhiro Ishimaru, Kimio Hagi | 1996-01-02 |
| 5430329 | Semiconductor device with bonding pad electrode | Takemi Endoh, Tomohiro Ishida | 1995-07-04 |
| 5362686 | Manufacturing method for protective silicon oxynitride film | — | 1994-11-08 |
| 5341026 | Semiconductor device having a titanium and a titanium compound multilayer interconnection structure | Kazuhiro Ishimaru, Kimio Hagi | 1994-08-23 |
| 5327464 | Dispersal signal removing apparatus | — | 1994-07-05 |
| 5313101 | Interconnection structure of semiconductor integrated circuit device | Junichi Arima, Noriaki Fujiki | 1994-05-17 |