Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5481137 | Semiconductor device with improved immunity to contact and conductor defects | Shigeru Harada, Reiji Tamaki | 1996-01-02 |
| 5260604 | Semiconductor device with improved immunity to contact and conductor defects | Shigeru Harada, Reiji Tamaki | 1993-11-09 |
| 5087590 | Method of manufacturing semiconductor devices | Hitoshi Fujimoto, Shuichi Osaka, Noriaki Uwagawa | 1992-02-11 |
| 4982728 | Apparatus for assembling semiconductor devices | Hitoshi Fujimoto, Shuichi Osaka | 1991-01-08 |
| 4916397 | Semiconductor device with bonding pad | Syuichi Osaka | 1990-04-10 |
| 4877173 | Wire bonding apparatus | Hitoshi Fujimoto | 1989-10-31 |