Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8021979 | Method of manufacturing semiconductor device | Takuya Futase | 2011-09-20 |
| 7851355 | Method of manufacturing semiconductor device | Takuya Futase | 2010-12-14 |
| 7582950 | Semiconductor chip having gettering layer, and method for manufacturing the same | Kazuhito Matsukawa, Tsuyoshi Koga, Akio Nishida, Yoshiko Higashide, Jun Shibata | 2009-09-01 |
| 7489040 | Interconnection structure of semiconductor device | Koyu Asai, Hiroyuki Kawata, Mahito Sawada | 2009-02-10 |
| 7154184 | Interconnection structure of semiconductor device | Koyu Asai, Hiroyuki Kawata, Mahito Sawada | 2006-12-26 |
| 6759317 | Method of manufacturing semiconductor device having passivation film and buffer coating film | Yuuki Kamiura, Seiji Okura, Mahito Sawada | 2004-07-06 |
| 6645859 | Semiconductor device and manufacturing method thereof | Mahito Sawada, Kouji Oda, Yuuki Kamiura, Kouji Shibata, Hiroyuki Kawata | 2003-11-11 |
| 6544904 | Method of manufacturing semiconductor device | Yuuki Kamiura, Kouji Oda, Mahito Sawada, Koji Shibata, Hiroyuki Kawata | 2003-04-08 |
| 6046488 | Semiconductor device having conductive layer and manufacturing method thereof | Takahiro Kawasaki, Shigeru Harada | 2000-04-04 |
| 5600151 | Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin | Etsushi Adachi, Hisoshi Adachi, Shigeyuki Yamamoto, Hiroyuki Nishimura, Shintaro Minami +1 more | 1997-02-04 |
| 5171711 | Method of manufacturing integrated circuit devices | — | 1992-12-15 |
| 5126828 | Wafer scale integration device | Muneo Hatta, Susumu Takeuchi | 1992-06-30 |