Issued Patents All Time
Showing 326–350 of 448 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6074902 | Method of forming complementary type conductive regions on a substrate | Charles H. Dennison | 2000-06-13 |
| 6075606 | Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates | — | 2000-06-13 |
| 6066548 | Advance metallization process | Manny K. F. Ma, Jeff Zhiqiang Wu | 2000-05-23 |
| 6066507 | Method to form an insulative barrier useful in field emission displays for reducing surface leakage | J. Brett Rolfson, Kevin Tjaden, Tyler A. Lowery, David A. Cathey | 2000-05-23 |
| 6063713 | Methods for forming silicon nitride layers on silicon-comprising substrates | — | 2000-05-16 |
| 6057581 | Self-aligned contacts | — | 2000-05-02 |
| 6054733 | Method for fabricating a flash EEPROM | Tyler Lowrey | 2000-04-25 |
| 6054396 | Semiconductor processing method of reducing thickness depletion of a silicide layer at a junction of different underlying layers | — | 2000-04-25 |
| 6048763 | Integrated capacitor bottom electrode with etch stop layer | Thomas A. Figura | 2000-04-11 |
| 6040245 | IC mechanical planarization process incorporating two slurry compositions for faster material removal times | Gurtej S. Sandhu, Richard L. Elliott, Jody D. Larsen | 2000-03-21 |
| 6025262 | Method of passivating semiconductor wafers | Mark E. Tuttle | 2000-02-15 |
| 6010935 | Self aligned contacts | — | 2000-01-04 |
| 6004196 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates | Gurtej S. Sandhu | 1999-12-21 |
| 5994224 | IC mechanical planarization process incorporating two slurry compositions for faster material removal times | Gurtej S. Sandhu, Richard L. Elliott, Jody D. Larsen | 1999-11-30 |
| 5989470 | Method for making polishing pad with elongated microcolumns | Scott Meikle | 1999-11-23 |
| 5976976 | Method of forming titanium silicide and titanium by chemical vapor deposition | Gurtej S. Sandhu, Kirk D. Prall, Sujit Sharan | 1999-11-02 |
| 5975994 | Method and apparatus for selectively conditioning a polished pad used in planarizng substrates | Gurtej S. Sandhu | 1999-11-02 |
| 5952050 | Chemical dispensing system for semiconductor wafer processing | — | 1999-09-14 |
| 5946595 | Method of forming a local interconnect between electronic devices on a semiconductor substrate | Zhiqiang Wu, Li Li | 1999-08-31 |
| 5936733 | Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers | Gurtej S. Sandhu | 1999-08-10 |
| 5925916 | Semiconductor processing method of providing electrical isolation between adjacent semiconductor diffusion regions of different field effect transistors and integrated circuitry having adjacent electrically isolated field effect transistors | Charles H. Dennison | 1999-07-20 |
| 5895243 | Semiconductor processing method of providing electrical isolation between adjacent semiconductor diffusion regions of different field effect transistors and integrated circuitry having adjacent electrically isolated field effect transistors | Charles H. Dennison | 1999-04-20 |
| 5872059 | Method of forming complementary type conductive regions on a substrate | Charles H. Dennison | 1999-02-16 |
| 5866465 | Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass | Charles H. Dennison | 1999-02-02 |
| 5866453 | Etch process for aligning a capacitor structure and an adjacent contact corridor | Kirk D. Prall, Pierre C. Fazan, Tyler Lowrey | 1999-02-02 |