Issued Patents All Time
Showing 76–100 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429086 | Method of depositing tungsten nitride using a source gas comprising silicon | Trung T. Doan | 2002-08-06 |
| 6426288 | Method for removing an upper layer of material from a semiconductor wafer | — | 2002-07-30 |
| 6426295 | Reduction of surface roughness during chemical mechanical planarization(CMP) | Stephen J. Kramer | 2002-07-30 |
| 6416401 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2002-07-09 |
| 6402884 | Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies | Karl M. Robinson | 2002-06-11 |
| 6404057 | Tantalum - aluminum - nitrogen material for semiconductor devices | Salman Akram | 2002-06-11 |
| 6395620 | Method for forming a planar surface over low density field areas on a semiconductor wafer | Pai-Hung Pan | 2002-05-28 |
| 6379225 | Planarization process with abrasive polishing slurry that is selective to a planarized surface | Karl M. Robinson, Guy F. Hudson | 2002-04-30 |
| 6361832 | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines | Vishnu K. Agarwal | 2002-03-26 |
| 6358122 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2002-03-19 |
| 6331135 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2001-12-18 |
| 6331488 | Planarization process for semiconductor substrates | Trung T. Doan, Guy T. Blalock, Mark Durcan | 2001-12-18 |
| 6313038 | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates | Dinesh Chopra | 2001-11-06 |
| 6290576 | Semiconductor processors, sensors, and semiconductor processing systems | Scott E. Moore, Magdel Crum | 2001-09-18 |
| 6280924 | Planarization method using fluid composition including chelating agents | John Skrovan | 2001-08-28 |
| 6273786 | Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad | Dinesh Chopra | 2001-08-14 |
| 6274897 | Semiconductor structure having interconnects on a projecting region and substrate | Guy T. Blalock, Sung-Cheol Kim, Kirk D. Prall | 2001-08-14 |
| 6271590 | Graded layer for use in semiconductor circuits and method for making same | Salman Akram | 2001-08-07 |
| 6250994 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Dinesh Chopra | 2001-06-26 |
| 6239492 | Semiconductor structure with a titanium aluminum nitride layer and method for fabricating same | Sung-Cheol Kim | 2001-05-29 |
| 6218295 | Semiconductor structure with a titanium aluminum nitride layer and method for fabricating the same | Sung-Cheol Kim | 2001-04-17 |
| 6206756 | Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad | Dinesh Chopra | 2001-03-27 |
| 6206759 | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines | Vishnu K. Agarwal | 2001-03-27 |
| 6194308 | Method of forming wire line | Everett A. McTeer, Russell C. Zahorik | 2001-02-27 |
| 6176763 | Method and apparatus for uniformly planarizing a microelectronic substrate | Stephen J. Kramer | 2001-01-23 |