Issued Patents All Time
Showing 51–75 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652363 | Method and apparatus for uniformly planarizing a microelectronic substrate | Stephen J. Kramer | 2003-11-25 |
| 6648736 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Dinesh Chopra | 2003-11-18 |
| 6638148 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Dinesh Chopra | 2003-10-28 |
| 6630403 | Reduction of surface roughness during chemical mechanical planarization (CMP) | Stephen J. Kramer | 2003-10-07 |
| 6611061 | Tantalum-aluminum-nitrogen material for semiconductor devices | Salman Akram | 2003-08-26 |
| 6609957 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Dinesh Chopra | 2003-08-26 |
| 6605539 | Electro-mechanical polishing of platinum container structure | Whonchee Lee | 2003-08-12 |
| 6599836 | Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies | Karl M. Robinson | 2003-07-29 |
| 6595833 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2003-07-22 |
| 6589101 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2003-07-08 |
| 6582281 | Semiconductor processing methods of removing conductive material | Trung T. Doan | 2003-06-24 |
| 6579799 | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates | Dinesh Chopra | 2003-06-17 |
| 6568998 | Method and apparatus for uniformly planarizing a microelectronic substrate | Stephen J. Kramer | 2003-05-27 |
| 6561878 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Dinesh Chopra | 2003-05-13 |
| 6552431 | Semiconductor structure with a titanium aluminum nitride layer and method for fabricating same | Sung-Cheol Kim | 2003-04-22 |
| 6548407 | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates | Dinesh Chopra | 2003-04-15 |
| 6545356 | Graded layer for use in semiconductor circuits and method for making same | Salman Akram | 2003-04-08 |
| 6509272 | Planarization method using fluid composition including chelating agents | John Skrovan | 2003-01-21 |
| 6488575 | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines | Vishnu K. Agarwal | 2002-12-03 |
| 6485356 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives | Gundu M. Sabde | 2002-11-26 |
| 6472323 | Method of depositing tungsten nitride using a source gas comprising silicon | Trung T. Doan | 2002-10-29 |
| 6450863 | Method and apparatus for uniformly planarizing a microelectronic substrate | Stephen J. Kramer | 2002-09-17 |
| 6451658 | Graded layer for use in semiconductor circuits and method for making same | Salman Akram | 2002-09-17 |
| 6440319 | Method and apparatus for predicting process characteristics of polyurethane pads | Guy F. Hudson | 2002-08-27 |
| 6432818 | Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices | Salman Akram | 2002-08-13 |