Issued Patents All Time
Showing 101–125 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6168696 | Non-knurled induction coil for ionized metal deposition, sputtering apparatus including same, and method of constructing the apparatus | Randle D. Burton, James A. Schindel | 2001-01-02 |
| 6136218 | Planarization fluid composition including chelating agents | John Skrovan | 2000-10-24 |
| 6133636 | Tantalum-aluminum-nitrogen material for semiconductor devices | Salman Akram | 2000-10-17 |
| 6114706 | Method and apparatus for predicting process characteristics of polyurethane pads | Guy F. Hudson | 2000-09-05 |
| 6062952 | Planarization process with abrasive polishing slurry that is selective to a planarized surface | Karl M. Robinson, Guy F. Hudson | 2000-05-16 |
| 6040613 | Antireflective coating and wiring line stack | Everett A. McTeer, Russell C. Zahorik | 2000-03-21 |
| 6002174 | Barrier materials for semiconductor devices | Salman Akram | 1999-12-14 |
| 5989470 | Method for making polishing pad with elongated microcolumns | Trung T. Doan | 1999-11-23 |
| 5980363 | Under-pad for chemical-mechanical planarization of semiconductor wafers | Laurence D. Schultz | 1999-11-09 |
| 5945348 | Method for reducing the heights of interconnects on a projecting region with a smaller reduction in the heights of other interconnects | Guy T. Blalock, Sung-Cheol Kim, Kirk D. Prall | 1999-08-31 |
| 5942449 | Method for removing an upper layer of material from a semiconductor wafer | — | 1999-08-24 |
| 5916819 | Planarization fluid composition chelating agents and planarization method using same | John Skrovan | 1999-06-29 |
| 5892281 | Tantalum-aluminum-nitrogen material for semiconductor devices | Salman Akram | 1999-04-06 |
| 5871392 | Under-pad for chemical-mechanical planarization of semiconductor wafers | Laurence D. Schultz | 1999-02-16 |
| 5801066 | Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers | — | 1998-09-01 |
| 5795218 | Polishing pad with elongated microcolumns | Trung T. Doan | 1998-08-18 |
| 5795495 | Method of chemical mechanical polishing for dielectric layers | — | 1998-08-18 |
| 5698455 | Method for predicting process characteristics of polyurethane pads | Guy F. Hudson | 1997-12-16 |
| 5691235 | Method of depositing tungsten nitride using a source gas comprising silicon | Trung T. Doan | 1997-11-25 |
| 5655951 | Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers | Lucky F. Marty | 1997-08-12 |
| 5609718 | Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers | — | 1997-03-11 |
| 5449314 | Method of chimical mechanical polishing for dielectric layers | Valerie A. Ward | 1995-09-12 |
| 5439551 | Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes | Trung T. Doan | 1995-08-08 |
| 5413941 | Optical end point detection methods in semiconductor planarizing polishing processes | Daniel A. Koos | 1995-05-09 |
| 5395801 | Chemical-mechanical polishing processes of planarizing insulating layers | Trung T. Doan | 1995-03-07 |