Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6690094 | High aspect ratio metallization structures | Shane P. Leiphart | 2004-02-10 |
| 6495921 | High aspect ratio metallization structures | Shane P. Leiphart | 2002-12-17 |
| 6320261 | High aspect ratio metallization structures for shallow junction devices, and methods of forming the same | John H. Givens | 2001-11-20 |
| 6316360 | High aspect ratio metallization structures for shallow junction devices, and methods of forming the same | John H. Givens | 2001-11-13 |
| 6258718 | Method for reducing surface charge on semiconductor wafers to prevent arcing during plasma deposition | Shane P. Leiphart | 2001-07-10 |
| 6168696 | Non-knurled induction coil for ionized metal deposition, sputtering apparatus including same, and method of constructing the apparatus | Scott Meikle, James A. Schindel | 2001-01-02 |
| 6121134 | High aspect ratio metallization structures and processes for fabricating the same | Shane P. Leiphart | 2000-09-19 |
| 6057235 | Method for reducing surface charge on semiconducter wafers to prevent arcing during plasma deposition | Shane P. Leiphart | 2000-05-02 |