| 7456452 |
Light sensor having undulating features for CMOS imager |
David H. Wells |
2008-11-25 |
| 7163893 |
Advanced barrier liner formation for vias |
— |
2007-01-16 |
| 6833623 |
Enhanced barrier liner formation for via |
— |
2004-12-21 |
| 6828233 |
Enhanced barrier liner formation for vias |
— |
2004-12-07 |
| 6800180 |
Resputtering to achieve better step coverage |
— |
2004-10-05 |
| 6690094 |
High aspect ratio metallization structures |
Randle D. Burton |
2004-02-10 |
| 6660136 |
Method of forming a non-volatile resistance variable device and method of forming a metal layer comprising silver and tungsten |
Jiutao Li |
2003-12-09 |
| 6495921 |
High aspect ratio metallization structures |
Randle D. Burton |
2002-12-17 |
| 6346177 |
Method of in-situ cleaning and deposition of device structures in a high density plasma environment |
— |
2002-02-12 |
| 6323124 |
Resputtering to achieve better step coverage |
— |
2001-11-27 |
| 6258718 |
Method for reducing surface charge on semiconductor wafers to prevent arcing during plasma deposition |
Randle D. Burton |
2001-07-10 |
| 6224942 |
Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon |
— |
2001-05-01 |
| 6187151 |
Method of in-situ cleaning and deposition of device structures in a high density plasma environment |
— |
2001-02-13 |
| 6121134 |
High aspect ratio metallization structures and processes for fabricating the same |
Randle D. Burton |
2000-09-19 |
| 6090246 |
Methods and apparatus for detecting reflected neutrals in a sputtering process |
— |
2000-07-18 |
| 6057235 |
Method for reducing surface charge on semiconducter wafers to prevent arcing during plasma deposition |
Randle D. Burton |
2000-05-02 |
| 5997699 |
Insitu faceting during deposition |
— |
1999-12-07 |
| 5985102 |
Kit for electrically isolating collimator of PVD chamber, chamber so modified, and method of using |
— |
1999-11-16 |
| 5928480 |
Methods of sputter depositing of metals onto substrates, and methods of forming plasma |
— |
1999-07-27 |
| 5882488 |
Resputtering to achieve better step coverage |
— |
1999-03-16 |
| 5783282 |
Resputtering to achieve better step coverage of contact holes |
— |
1998-07-21 |
| 5705042 |
Electrically isolated collimator and method |
Richard L. Elliot |
1998-01-06 |
| 5667645 |
Method of sputter deposition |
— |
1997-09-16 |
