Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9214359 | Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates | — | 2015-12-15 |
| 8557132 | Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning | Scott Meikle | 2013-10-15 |
| 8232206 | Methods of forming electrical contacts to structures that are at different heights over a substrate relative to one another | Nishant Sinha, Fred Fishburn | 2012-07-31 |
| 7713817 | Methods of forming semiconductor structures | Nishant Sinha, Fred Fishburn | 2010-05-11 |
| 7662719 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Nishant Sinha | 2010-02-16 |
| 7573116 | Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device | Bradley J. Howard | 2009-08-11 |
| 7476305 | Recovery system for platinum plating bath | — | 2009-01-13 |
| 7438632 | Method and apparatus for cleaning a web-based chemical mechanical planarization system | Scott E. Moore | 2008-10-21 |
| 7402094 | Fixed-abrasive chemical-mechanical planarization of titanium nitride | Gundu M. Sabde | 2008-07-22 |
| 7385290 | Electrochemical reaction cell for a combined barrier layer and seed layer | — | 2008-06-10 |
| 7335935 | Semiconductor structures | Nishant Sinha, Fred Fishburn | 2008-02-26 |
| 7329607 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Fred Fishburn | 2008-02-12 |
| 7278905 | Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation | Scott E. Moore | 2007-10-09 |
| 7273411 | Polishing apparatus | Scott E. Moore | 2007-09-25 |
| 7220663 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Fred Fishburn | 2007-05-22 |
| 7214614 | System for controlling metal formation processes using ion implantation | — | 2007-05-08 |
| 7176576 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Fred Fishburn | 2007-02-13 |
| 7129160 | Method for simultaneously removing multiple conductive materials from microelectronic substrates | — | 2006-10-31 |
| 7118686 | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Nishant Sinha | 2006-10-10 |
| 7112245 | Apparatuses for forming a planarizing pad for planarization of microlectronic substrates | Vishnu K. Agarwal | 2006-09-26 |
| 7109112 | Method of providing a structure using self-aligned features | Kevin G. Donohoe, Cem Basceri | 2006-09-19 |
| 7094699 | Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device | Bradley J. Howard | 2006-08-22 |
| 7063603 | Method and apparatus for cleaning a web-based chemical mechanical planarization system | Scott E. Moore | 2006-06-20 |
| 7041595 | Method of forming a barrier seed layer with graded nitrogen composition | — | 2006-05-09 |
| 7005379 | Semiconductor processing methods for forming electrical contacts | Nishant Sinha, Fred Fishburn | 2006-02-28 |