Issued Patents All Time
Showing 51–75 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670288 | Methods of forming a layer of silicon nitride in a semiconductor fabrication process | John T. Moore, Mark Fischer, Randhir P. S. Thakur | 2003-12-30 |
| 6670238 | Method and structure for reducing contact aspect ratios | Vishnu K. Agarwal | 2003-12-30 |
| 6635530 | Methods of forming gated semiconductor assemblies | Mark A. Helm, Mark Fischer, John T. Moore | 2003-10-21 |
| 6632719 | Capacitor structures with recessed hemispherical grain silicon | Whonchee Lee | 2003-10-14 |
| 6627508 | Method of forming capacitors containing tantalum | F. Daniel Gealy, Randhir P. S. Thakur | 2003-09-30 |
| 6614082 | Fabrication of semiconductor devices with transition metal boride films as diffusion barriers | Husam N. Al-Shareef | 2003-09-02 |
| 6613654 | Fabrication of semiconductor devices with transition metal boride films as diffusion barriers | Husam N. Al-Shareef | 2003-09-02 |
| 6610211 | Method of processing internal surfaces of a chemical vapor deposition reactor | F. Daniel Gealy, Husam N. Al-Shareef | 2003-08-26 |
| 6607953 | Structural integrity enhancement of dielectric films | — | 2003-08-19 |
| 6596651 | Method for stabilizing high pressure oxidation of a semiconductor device | F. Daniel Gealy, Dave Chapek, Husam N. Al-Shareef, Randhir P. S. Thakur | 2003-07-22 |
| 6593616 | Buried bit line memory circuitry | Yongjun Jeff Hu, Pai-Hung Pan | 2003-07-15 |
| 6566222 | Methods of forming recessed hemispherical grain silicon capacitor structures | — | 2003-05-20 |
| 6548405 | Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride | Brenda D. Kraus, John T. Moore | 2003-04-15 |
| 6531728 | Oxide etching method and structures resulting from same | Terry L. Gilton, Ceredig Roberts | 2003-03-11 |
| 6528436 | Method of forming silicon nitride layer directly on HSG polysilicon | Klaus Schuegraf, Randhir P. S. Thakur, Robert K. Carstensen | 2003-03-04 |
| 6525384 | Conductor layer nitridation | Yongjun Jeff Hu, Randhir P. S. Thakur | 2003-02-25 |
| 6518121 | Boride electrodes and barriers for cell dielectrics | Husam N. Al-Shareef, Dan Gealy, Randhir P. S. Thakur | 2003-02-11 |
| 6486020 | High pressure reoxidation/anneal of high dielectric constant materials | Randhir P. S. Thakur | 2002-11-26 |
| 6469336 | Structure for reducing contact aspect ratios | Vishnu K. Agarwal | 2002-10-22 |
| 6461985 | Semiconductor wafer assemblies comprising silicon nitride, methods of forming silicon nitride, and methods of reducing stress on semiconductive wafers | John T. Moore, Mark Fischer | 2002-10-08 |
| 6461982 | Methods for forming a dielectric film | Randhir P. S. Thakur | 2002-10-08 |
| 6458645 | Capacitor having tantalum oxynitride film and method for making same | Husam N. Al-Shareef, Randhir P. S. Thakur, Dan Gealy | 2002-10-01 |
| 6455365 | Structural integrity enhancement of dielectric films | — | 2002-09-24 |
| 6440860 | Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride | John T. Moore | 2002-08-27 |
| 6436818 | Semiconductor structure having a doped conductive layer | Yongjun Jeff Hu, Pai-Hung Pan, Er-Xuan Ping, Randhir P. S. Thakur | 2002-08-20 |