Issued Patents All Time
Showing 101–122 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6251720 | High pressure reoxidation/anneal of high dielectric constant materials | Randhir P. S. Thakur | 2001-06-26 |
| 6251802 | Methods of forming carbon-containing layers | John T. Moore, Guy T. Blalock | 2001-06-26 |
| 6222222 | Methods of forming capacitors and related integrated circuitry | Klaus Schuegraf, Randhir P. S. Thakur | 2001-04-24 |
| 6218293 | Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride | Brenda D. Kraus, John T. Moore | 2001-04-17 |
| 6204143 | Method of forming high aspect ratio structures for semiconductor devices | Ceredig Roberts | 2001-03-20 |
| 6194321 | Semiconductor processing methods utilizing boron and nitrogen, and semiconductor wafers comprising boron and nitrogen | John T. Moore | 2001-02-27 |
| 6191443 | Capacitors, methods of forming capacitors, and DRAM memory cells | Husam N. Al-Shareef, F. Daniel Gealy, Randhir P. S. Thakur | 2001-02-20 |
| 6180481 | Barrier layer fabrication methods | Randhir P. S. Thakur | 2001-01-30 |
| 6162744 | Method of forming capacitors having high-K oxygen containing capacitor dielectric layers, method of processing high-K oxygen containing dielectric layers, method of forming a DRAM cell having having high-K oxygen containing capacitor dielectric layers | Husam N. Al-Shareef, Randhir P. S. Thakur | 2000-12-19 |
| 6150208 | DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films | Klaus Schuegraf, Ronald A. Weimer, Randhir P. S. Thakur | 2000-11-21 |
| 6146959 | Method of forming capacitors containing tantalum | F. Daniel Gealy, Randhir P. S. Thakur | 2000-11-14 |
| 6111285 | Boride electrodes and barriers for cell dielectrics | Husam N. Al-Shareef, Dan Gealy, Randhir P. S. Thakur | 2000-08-29 |
| 6093956 | Semiconductor wafer assemblies comprising silicon nitride, methods of forming silicon nitride, and methods of reducing stress on semiconductive wafers | John T. Moore, Mark Fischer | 2000-07-25 |
| 6090723 | Conditioning of dielectric materials | Randhir P. S. Thakur | 2000-07-18 |
| 6082375 | Method of processing internal surfaces of a chemical vapor deposition reactor | F. Daniel Gealy, Husam N. Al-Shareef | 2000-07-04 |
| 6015997 | Semiconductor structure having a doped conductive layer | Yongjun Jeff Hu, Pai-Hung Pan, Er-Xuan Ping, Randhir P. S. Thakur | 2000-01-18 |
| 5989338 | Method for depositing cell nitride with improved step coverage using MOCVD in a wafer deposition system | Randhir P. S. Thakur | 1999-11-23 |
| 5985771 | Semiconductor wafer assemblies comprising silicon nitride, methods of forming silicon nitride, and methods of reducing stress on semiconductive wafers | John T. Moore, Mark Fischer | 1999-11-16 |
| 5960294 | Method of fabricating a semiconductor device utilizing polysilicon grains | John K. Zahurak, Randhir P. S. Thakur, Mark Fischer | 1999-09-28 |
| 5930106 | DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films | Klaus Schuegraf, Ronald A. Weimer, Randhir P. S. Thakur | 1999-07-27 |
| 5926730 | Conductor layer nitridation | Yongjun Jeff Hu, Randhir P. S. Thakur | 1999-07-20 |
| 5910880 | Semiconductor circuit components and capacitors | F. Daniel Gealy, Randhir P. S. Thakur | 1999-06-08 |