Issued Patents All Time
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7176576 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Dinesh Chopra | 2007-02-13 |
| 7157324 | Transistor structure having reduced transistor leakage attributes | Vishnu K. Agarwal, Rongsheng Yang, Howard E. Rhodes, Jeffrey McKee | 2007-01-02 |
| 7153778 | Methods of forming openings, and methods of forming container capacitors | Brett W. Busch, Luan C. Tran, Ardavan Niroomand, Yoshiki Hishiro, Ulrich Boettiger +1 more | 2006-12-26 |
| 7135401 | Methods of forming electrical connections for semiconductor constructions | Luan C. Tran | 2006-11-14 |
| 7107777 | MEMS heat pumps for integrated circuit heat dissipation | Venkateshwaran Vaiyapuri | 2006-09-19 |
| 7105899 | Transistor structure having reduced transistor leakage attributes | Vishnu K. Agarwal, Rongsheng Yang, Howard E. Rhodes, Jeffrey McKee | 2006-09-12 |
| 7084004 | MEMS heat pumps for integrated circuit heat dissipation | Venkateshwaran Vaiyapuri | 2006-08-01 |
| 7071055 | Method of forming a contact structure including a vertical barrier structure and two barrier layers | — | 2006-07-04 |
| 7067378 | Methods of fabricating multiple sets of field effect transistors | Martin C. Roberts | 2006-06-27 |
| 7060569 | Methods of fabricating multiple sets of field effect transistors | Martin C. Roberts | 2006-06-13 |
| 7060570 | Methods of fabricating multiple sets of field effect transistors | Martin C. Roberts | 2006-06-13 |
| 7005379 | Semiconductor processing methods for forming electrical contacts | Nishant Sinha, Dinesh Chopra | 2006-02-28 |
| 6984893 | Low temperature nitride used as Cu barrier layer | Zhiping Yin, Eden Zielinski | 2006-01-10 |
| 6962846 | Methods of forming a double-sided capacitor or a contact using a sacrificial structure | Forest Chen, John M. Drynan | 2005-11-08 |
| 6927135 | Methods of fabricating multiple sets of field effect transistors | Martin C. Roberts | 2005-08-09 |
| 6787833 | Integrated circuit having a barrier structure | — | 2004-09-07 |
| 6756678 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Dinesh Chopra | 2004-06-29 |
| 6707088 | Method of forming integrated circuitry, method of forming a capacitor, method of forming DRAM integrated circuitry and DRAM integrated category | — | 2004-03-16 |
| 6613671 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Dinesh Chopra | 2003-09-02 |
| 6492267 | Low temperature nitride used as Cu barrier layer | Zhiping Yin, Eden Zielinski | 2002-12-10 |
| 6475855 | Method of forming integrated circuitry, method of forming a capacitor and method of forming DRAM integrated circuitry | — | 2002-11-05 |
| 6372574 | Method of forming a capacitor container electrode and method of patterning a metal layer by selectively silicizing the electrode or metal layer and removing the silicized portion | Richard H. Lane | 2002-04-16 |
| 5972796 | In-situ barc and nitride etch process | Ming Yang, Masahiro Kaida, Tom Lassister | 1999-10-26 |
| 5252506 | Method to eliminate gate filaments on field plate isolated devices | Duane E. Carter, William R. McKee, Gishi Chung | 1993-10-12 |