Issued Patents All Time
Showing 26–50 of 126 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8384105 | Light emitting diodes with enhanced thermal sinking and associated methods of operation | Kevin Tetz | 2013-02-26 |
| 8273589 | Light emitting diodes and methods for manufacturing light emitting diodes | — | 2012-09-25 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Kyle K. Kirby, Alan G. Wood, William M. Hiatt | 2011-11-08 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Mark Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2011-06-07 |
| 7858429 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Kyle K. Kirby, Alan G. Wood, William M. Hiatt | 2010-12-28 |
| 7855140 | Method of forming vias in semiconductor substrates and resulting structures | Kyle K. Kirby, Alan G. Wood, Salman Akram, Warren M. Farnworth | 2010-12-21 |
| 7795737 | Methods of redistributing bondpad locations on an integrated circuit | — | 2010-09-14 |
| 7759800 | Microelectronics devices, having vias, and packaged microelectronic devices having vias | Sidney B. Rigg, Kyle K. Kirby, Peter Benson, Salman Akram | 2010-07-20 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2010-05-04 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2010-03-23 |
| 7629250 | Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies | Peter Benson | 2009-12-08 |
| 7598167 | Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures | Kyle K. Kirby, Alan G. Wood, Salman Akram, Warren M. Farnworth | 2009-10-06 |
| 7579684 | Methods for packing microfeature devices and microfeature devices formed by such methods | Peter Benson | 2009-08-25 |
| 7575999 | Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies | Peter Benson | 2009-08-18 |
| 7521296 | Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material | Alan G. Wood, Warren M. Farnworth, Peter Benson | 2009-04-21 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2009-03-17 |
| 7498240 | Microfeature workpieces, carriers, and associated methods | William M. Hiatt | 2009-03-03 |
| 7488618 | Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same | Alan G. Wood, Warren M. Farnworth, Peter Benson | 2009-02-10 |
| 7456639 | Compliant contact structure | Kyle K. Kirby | 2008-11-25 |
| 7442643 | Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials | Alan G. Wood, Warren M. Farnworth, Peter Benson | 2008-10-28 |
| 7439169 | Integrated circuit and methods of redistributing bondpad locations | — | 2008-10-21 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2008-09-02 |
| 7413979 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Sidney B. Rigg, Kyle K. Kirby, Peter Benson, Salman Akram | 2008-08-19 |
| 7389581 | Method of forming compliant contact structures | Kyle K. Kirby | 2008-06-24 |
| 7385412 | Systems and methods for testing microfeature devices | Salman Akram, William M. Hiatt, Alan G. Wood, Kyle K. Kirby | 2008-06-10 |