Issued Patents All Time
Showing 251–275 of 354 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7439627 | Post passivation interconnection schemes on top of the IC chips | Jin-Yuan Lee | 2008-10-21 |
| 7439626 | Post passivation interconnection schemes on top of IC chip | Jin-Yuan Lee | 2008-10-21 |
| 7427560 | Top layers of metal for high performance IC's | Jin-Yuan Lee | 2008-09-23 |
| 7425767 | Chip structure with redistribution traces | — | 2008-09-16 |
| 7425764 | Top layers of metal for high performance IC's | — | 2008-09-16 |
| 7422941 | High performance system-on-chip using post passivation process | — | 2008-09-09 |
| 7422976 | Top layers of metal for high performance IC's | — | 2008-09-09 |
| 7423346 | Post passivation interconnection process and structures | Chiu-Ming Chou, Chien-Kang Chou | 2008-09-09 |
| 7419900 | Post passivation interconnection schemes on top of the IC chips | Jin-Yuan Lee | 2008-09-02 |
| 7420276 | Post passivation structure for semiconductor chip or wafer | Jin-Yuan Lee | 2008-09-02 |
| 7417317 | Post passivation interconnection schemes on top of the IC chips | Chiu-Ming Chou, Chien-Kang Chou | 2008-08-26 |
| 7416971 | Top layers of metal for integrated circuits | Chiu-Ming Chou, Chien-Kang Chou | 2008-08-26 |
| 7413929 | Integrated chip package structure using organic substrate and method of manufacturing the same | Jin-Yuan Lee, Ching-Cheng Huang | 2008-08-19 |
| 7405150 | Post passivation interconnection schemes on top of the IC chips | Jin-Yuan Lee | 2008-07-29 |
| 7405149 | Post passivation method for semiconductor chip or wafer | Jin-Yuan Lee | 2008-07-29 |
| 7397135 | Top layers of metal for high performance IC's | — | 2008-07-08 |
| 7397121 | Semiconductor chip with post-passivation scheme formed over passivation layer | Chiu-Ming Chou, Chien-Kang Chou, Ching-San Lin, Hsin-Jung Lo | 2008-07-08 |
| 7397117 | Chip package with die and substrate | Jin-Yuan Lee, Ching-Cheng Huang | 2008-07-08 |
| 7396756 | Top layers of metal for high performance IC's | — | 2008-07-08 |
| 7388292 | Top layers of metal for high performance IC's | — | 2008-06-17 |
| 7385292 | Top layers of metal for high performance IC's | — | 2008-06-10 |
| 7385291 | Top layers of metal for high performance IC's | — | 2008-06-10 |
| 7384864 | Top layers of metal for high performance IC's | — | 2008-06-10 |
| 7382058 | Top layers of metal for high performance IC's | — | 2008-06-03 |
| 7382052 | Post passivation interconnection schemes on top of IC chip | Jin-Yuan Lee | 2008-06-03 |