Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723322 | Method of metal sputtering for integrated circuit metal routing | Hsien-Tsung Liu, Chien-Kang Chou | 2014-05-13 |
| 8617963 | Integrated circuit wafer dicing method | Kun-Tai Wu, Chih-Chao Wang | 2013-12-31 |
| 8518743 | Die structure and die connecting method | Chia-Hung Hsu, Chin-Yung Chen | 2013-08-27 |
| 8319354 | Semiconductor chip with post-passivation scheme formed over passivation layer | Mou-Shiung Lin, Hsin-Jung Lo, Chien-Kang Chou, Chiu-Ming Chou | 2012-11-27 |
| 8242601 | Semiconductor chip with passivation layer comprising metal interconnect and contact pads | Chiu-Ming Chou, Chien-Kang Chou, Mou-Shiung Lin | 2012-08-14 |
| 8004092 | Semiconductor chip with post-passivation scheme formed over passivation layer | Mou-Shiung Lin, Hsin-Jung Lo, Chien-Kang Chou, Chiu-Ming Chou | 2011-08-23 |
| 7547969 | Semiconductor chip with passivation layer comprising metal interconnect and contact pads | Chiu-Ming Chou, Chien-Kang Chou, Mou-Shiung Lin | 2009-06-16 |
| 7397121 | Semiconductor chip with post-passivation scheme formed over passivation layer | Chiu-Ming Chou, Chien-Kang Chou, Mou-Shiung Lin, Hsin-Jung Lo | 2008-07-08 |
| 6802945 | Method of metal sputtering for integrated circuit metal routing | Hsien-Tsung Liu, Chien-Kang Chou | 2004-10-12 |